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Assignee profile:

Subtron Technology Co., Ltd.

City:

Hsinchu

Country:

Taiwan

Published Applications:

43

Last publication date:

2015-10-29

Patent Grants:

29

Last grant date:

2016-04-12

Top Inventors for applications by Subtron Technology Co., Ltd.

These are the the leading inventors for applications assigned to Subtron Technology Co., Ltd.:

Recent patent applications by Subtron Technology Co., Ltd.

Subtron Technology Co., Ltd. based in Hsinchu, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-10-29 ✅ Patent 9,313,886 granted on 2016-04-12
US20150313007A1
Electricity

Substrate structure and manufacturing method thereof

 #2 | 2014-01-02 ✅ Patent 8,973,258 granted on 2015-03-10
US20140000109A1
Electricity

Manufacturing method of substrate structure

 #3 | 2013-12-12
US20130329386A1
Electricity

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

 #4 | 2013-12-05
US20130319620A1
Electricity

BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOF

 #5 | 2013-10-31 ✅ Patent 8,766,463 granted on 2014-07-01
US20130285252A1
Electricity

Package carrier

 #6 | 2013-10-17 ✅ Patent 8,587,115 granted on 2013-11-19
US20130273388A1
Electricity

Heat dissipation substrate and manufacturing method thereof

 #7 | 2013-10-17 ✅ Patent 8,704,101 granted on 2014-04-22
US20130269986A1
Electricity

Package carrier and manufacturing method thereof

 #8 | 2013-10-03 ✅ Patent 8,845,909 granted on 2014-09-30
US20130260018A1
Electricity

Process of fabricating heat dissipation substrate

 #9 | 2013-08-15 ✅ Patent 8,939,188 granted on 2015-01-27
US20130206331A1
Performing operations; transporting

Edge separation equipment and operating method thereof

 #10 | 2013-07-04 ✅ Patent 9,330,941 granted on 2016-05-03
US20130170148A1
Electricity

Package carrier and manufacturing method thereof

 #11 | 2013-05-02
US20130107246A1
Physics

OPTICAL TOUCH SENSING STRUCTURE AND MANUFACTURING METHOD THEREOF

 #12 | 2013-04-18 ✅ Patent 8,991,043 granted on 2015-03-31
US20130092422A1
Electricity

Manufacturing method of a circuit board structure

 #13 | 2013-02-21
US20130043016A1
Electricity

STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE

 #14 | 2013-01-10 ✅ Patent 8,563,363 granted on 2013-10-22
US20130011971A1
Electricity

Fabricating method of semiconductor package structure

 #15 | 2012-12-13
US20120314369A1
Electricity

PACKAGE CARRIER AND PACKAGE STRUCTURE

 #16 | 2012-11-22
US20120293977A1
Electricity

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

 #17 | 2012-11-22 ✅ Patent 8,541,881 granted on 2013-09-24
US20120292780A1
Electricity

Package structure and manufacturing method thereof

 #18 | 2012-11-22 ✅ Patent 8,384,216 granted on 2013-02-26
US20120292762A1
Electricity

Package structure and manufacturing method thereof

 #19 | 2012-11-15 ✅ Patent 8,737,081 granted on 2014-05-27
US20120285719A1
Electricity

Cover structure and manufacturing method thereof

 #20 | 2012-11-08 ✅ Patent 8,552,303 granted on 2013-10-08
US20120282738A1
Electricity

Circuit structure and manufacturing method thereof

 #21 | 2012-11-08 ✅ Patent 8,803,295 granted on 2014-08-12
US20120280371A1
Electricity

Circuit structure and manufacturing method thereof

 #22 | 2012-11-08 ✅ Patent 9,655,254 granted on 2017-05-16
US20120280022A1
Electricity

Manufacturing method of circuit substrate

 #23 | 2012-11-08 ✅ Patent 9,153,521 granted on 2015-10-06
US20120279962A1
Electricity

Method of manufacturing a package carrier

 #24 | 2012-11-08 ✅ Patent 8,420,951 granted on 2013-04-16
US20120279772A1
Electricity

Package structure

 #25 | 2012-11-08 ✅ Patent 8,513,530 granted on 2013-08-20
US20120279760A1
Electricity

Package carrier and manufacturing method thereof

 #26 | 2012-11-08 ✅ Patent 9,603,263 granted on 2017-03-21
US20120279630A1
Electricity

Manufacturing method of circuit substrate

 #27 | 2012-09-13 ✅ Patent 9,137,899 granted on 2015-09-15
US20120228015A1
Electricity

Process of electronic structure and electronic structure

 #28 | 2012-07-12
US20120175044A1
Electricity

MANUFACTURING METHOD OF THERMAL CONDUCTIVITY SUBSTRATE

 #29 | 2012-04-12
US20120088117A1
Electricity

SUBSTRATE STRUCTURE

 #30 | 2012-01-12 ✅ Patent 8,390,013 granted on 2013-03-05
US20120007252A1
Electricity

Semiconductor package structure and fabricating method of semiconductor package structure

 #31 | 2011-10-20
US20110253439A1
Electricity

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

 #32 | 2011-06-30
US20110154658A1
Electricity

CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

 #33 | 2011-06-30 ✅ Patent 8,510,936 granted on 2013-08-20
US20110154657A1
Electricity

Manufacturing method of package carrier

 #34 | 2010-08-19 ✅ Patent 7,838,338 granted on 2010-11-23
US20100206463A1
Electricity

Fabricating process of thermal enhanced substrate

 #35 | 2009-12-24
US20090314650A1
Electricity

PROCESS OF PACKAGE SUBSTRATE

 #36 | 2009-11-26
US20090288859A1
Electricity

NON-CYLINDER VIA STRUCTURE AND THERMAL ENHANCED SUBSTRATE HAVING THE SAME

 #37 | 2009-11-12 ✅ Patent 7,674,672 granted on 2010-03-09
US20090280617A1
Electricity

Fabricating process for substrate with embedded passive component

 #38 | 2009-08-06
US20090196979A1
Electricity

INKJET PRINTING PROCESS FOR CIRCUIT BOARD

 #39 | 2009-06-04
US20090139756A1
Electricity

FABRICATING PROCESS OF CIRCUIT BOARD WITH EMBEDDED PASSIVE COMPONENT

 #40 | 2008-12-18 ✅ Patent 7,786,501 granted on 2010-08-31
US20080308925A1
Electricity

Fabricating process and structure of thermal enhanced substrate

 #41 | 2007-06-07 ✅ Patent 7,540,969 granted on 2009-06-02
US20070126093A1
Electricity

High thermal conducting circuit substrate and manufacturing process thereof

 #42 | 2007-05-29 ✅ Patent 7,223,687 granted on 2007-05-29
US11465873
-

Printed wiring board and method of fabricating the same

 #43 | 2005-12-22 ✅ Patent 7,441,329 granted on 2008-10-28
US20050282309A1
Electricity

Fabrication process circuit board with embedded passive component
AssigneeID:

3549 ⎘