Hsinchu County
Taiwan
26
2026-04-16
The entities that hold a legal rights for patent applications filed by inventor Chen Ching-Sheng:
Ching-Sheng Chen from Hsinchu County, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
CIRCUIT BOARD STRUCTURE
#2 | 2025-02-13MANUFACTURING METHOD OF CIRCUIT BOARD
#3 | 2024-08-22MANUFACTURING METHOD OF CIRCUIT BOARD
#4 | 2023-11-30Manufacturing method of circuit board
#5 | 2022-12-01Interlayer connective structure of wiring board and method of manufacturing the same
#6 | 2022-07-28CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME
#7 | 2022-07-28Co-axial via structure
#8 | 2022-07-21Circuit board and manufacturing method thereof and electronic device
#9 | 2022-07-21Circuit board and manufacturing method thereof and electronic device
#10 | 2022-07-21Circuit board having laminated build-up layers
#11 | 2021-03-11Package structure and manufacturing method thereof
#12 | 2017-11-09MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
#13 | 2017-01-12Circuit board and manufacturing method thereof
#14 | 2016-09-29HEAT DISSIPATION PLATE AND PACKAGE STRUCTURE
#15 | 2016-03-31HEAT DISSIPATION MODULE
#16 | 2015-06-11Circuit board and manufacturing method thereof
#17 | 2015-05-28HEAT DISSIPATION SUBSTRATE
#18 | 2015-04-02Package carrier
#19 | 2014-11-27HEAT DISSIPATION PLATE
#20 | 2014-10-02Manufacturing method of circuit structure
#21 | 2014-01-02Manufacturing method of substrate structure
#22 | 2013-12-05Manufacturing method of circuit structure
#23 | 2012-11-08Circuit structure and manufacturing method thereof
#24 | 2012-11-08Circuit structure and manufacturing method thereof
#25 | 2012-07-12MANUFACTURING METHOD OF THERMAL CONDUCTIVITY SUBSTRATE
#26 | 2012-03-22THERMAL CONDUCTIVITY SUBSTRATE AND MANUFACTURING METHOD THEREOF
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