Assignee profile:

Fab Solutions, Inc.

City:

Kanagawa

Country:

Japan

Published Applications:

16

Last publication date:

2006-05-04

Patent Grants:

16

Last grant date:

2007-06-19

Top Inventors for applications by Fab Solutions, Inc.

These are the the leading inventors for applications assigned to Fab Solutions, Inc.:

Recent patent applications by Fab Solutions, Inc.

Fab Solutions, Inc. based in Kanagawa, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-05-04 ✅ Patent 7,232,994 granted on 2007-06-19
US20060093789A1
Physics

Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer

#2 | 2006-01-03 ✅ Patent 6,982,418 granted on 2006-01-03
US10868615
-

Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer

#3 | 2005-12-13 ✅ Patent 6,975,125 granted on 2005-12-13
US10842167
-

Semiconductor device tester

#4 | 2005-11-22 ✅ Patent 6,967,327 granted on 2005-11-22
US10863139
-

Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer

#5 | 2005-10-27 ✅ Patent 7,049,834 granted on 2006-05-23
US20050237069A1
Physics

Semiconductor device test method and semiconductor device tester

#6 | 2005-09-20 ✅ Patent 6,946,857 granted on 2005-09-20
US10868582
-

Semiconductor device tester

#7 | 2005-09-13 ✅ Patent 6,943,043 granted on 2005-09-13
US10831851
-

Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device

#8 | 2005-09-06 ✅ Patent 6,940,296 granted on 2005-09-06
US10843158
-

Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer

#9 | 2005-07-05 ✅ Patent 6,914,444 granted on 2005-07-05
US10868581
-

Semiconductor device test method and semiconductor device tester

#10 | 2005-06-02 ✅ Patent 7,002,361 granted on 2006-02-21
US20050116726A1
Physics

Film thickness measuring apparatus and a method for measuring a thickness of a film

#11 | 2005-05-31 ✅ Patent 6,900,645 granted on 2005-05-31
US10863704
-

Semiconductor device test method and semiconductor device tester

#12 | 2005-05-24 ✅ Patent 6,897,440 granted on 2005-05-24
US9451440
-

Contact hole standard test device

#13 | 2005-05-19 ✅ Patent 7,321,805 granted on 2008-01-22
US20050106803A1
Electricity

Production managing system of semiconductor device

#14 | 2005-02-01 ✅ Patent 6,850,079 granted on 2005-02-01
US10342242
-

Film thickness measuring apparatus and a method for measuring a thickness of a film

#15 | 2005-01-11 ✅ Patent 6,842,663 granted on 2005-01-11
US10790276
-

Production managing system of semiconductor device

#16 | 2005-01-04 ✅ Patent 6,837,936 granted on 2005-01-04
US10078357
-

Semiconductor manufacturing device

AssigneeID:

362674 ⎘