Kanagawa
Japan
16
2006-05-04
16
2007-06-19
These are the the leading inventors for applications assigned to Fab Solutions, Inc.:
Fab Solutions, Inc. based in Kanagawa, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
#2 | 2006-01-03 ✅ Patent 6,982,418 granted on 2006-01-03Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
#3 | 2005-12-13 ✅ Patent 6,975,125 granted on 2005-12-13Semiconductor device tester
#4 | 2005-11-22 ✅ Patent 6,967,327 granted on 2005-11-22Contact hole standard test device, method of forming the same, method testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
#5 | 2005-10-27 ✅ Patent 7,049,834 granted on 2006-05-23Semiconductor device test method and semiconductor device tester
#6 | 2005-09-20 ✅ Patent 6,946,857 granted on 2005-09-20Semiconductor device tester
#7 | 2005-09-13 ✅ Patent 6,943,043 granted on 2005-09-13Surface contamination analyzer for semiconductor wafers, method used therein and process for fabricating semiconductor device
#8 | 2005-09-06 ✅ Patent 6,940,296 granted on 2005-09-06Contact hole standard test device, method of forming the same, method of testing contact hole, method and apparatus for measuring a thickness of a film, and method of testing a wafer
#9 | 2005-07-05 ✅ Patent 6,914,444 granted on 2005-07-05Semiconductor device test method and semiconductor device tester
#10 | 2005-06-02 ✅ Patent 7,002,361 granted on 2006-02-21Film thickness measuring apparatus and a method for measuring a thickness of a film
#11 | 2005-05-31 ✅ Patent 6,900,645 granted on 2005-05-31Semiconductor device test method and semiconductor device tester
#12 | 2005-05-24 ✅ Patent 6,897,440 granted on 2005-05-24Contact hole standard test device
#13 | 2005-05-19 ✅ Patent 7,321,805 granted on 2008-01-22Production managing system of semiconductor device
#14 | 2005-02-01 ✅ Patent 6,850,079 granted on 2005-02-01Film thickness measuring apparatus and a method for measuring a thickness of a film
#15 | 2005-01-11 ✅ Patent 6,842,663 granted on 2005-01-11Production managing system of semiconductor device
#16 | 2005-01-04 ✅ Patent 6,837,936 granted on 2005-01-04Semiconductor manufacturing device
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