Taiwan
41
2014-09-18
41
2015-11-03
These are the the leading inventors for applications assigned to Advanced Semiconductor Engineering, Inc.:
Advanced Semiconductor Engineering, Inc. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Neural sensing device and method for making the same
#2 | 2014-09-18 ✅ Patent 9,089,268 granted on 2015-07-28Neural sensing device and method for making the same
#3 | 2014-09-18 ✅ Patent 8,987,734 granted on 2015-03-24Semiconductor wafer, semiconductor process and semiconductor package
#4 | 2014-08-28 ✅ Patent 9,978,688 granted on 2018-05-22Semiconductor package having a waveguide antenna and manufacturing method thereof
#5 | 2014-06-26 ✅ Patent 9,406,552 granted on 2016-08-02Semiconductor device having conductive via and manufacturing process
#6 | 2014-05-15 ✅ Patent 8,952,542 granted on 2015-02-10Method for dicing a semiconductor wafer having through silicon vias and resultant structures
#7 | 2014-05-08 ✅ Patent 8,937,387 granted on 2015-01-20Semiconductor device with conductive vias
#8 | 2014-02-06 ✅ Patent 9,153,542 granted on 2015-10-06Semiconductor package having an antenna and manufacturing method thereof
#9 | 2013-11-07 ✅ Patent 8,786,060 granted on 2014-07-22Semiconductor package integrated with conformal shield and antenna
#10 | 2013-10-10 ✅ Patent 8,618,677 granted on 2013-12-31Wirebonded semiconductor package
#11 | 2013-08-15 ✅ Patent 8,963,316 granted on 2015-02-24Semiconductor device and method for manufacturing the same
#12 | 2013-08-08 ✅ Patent 8,975,157 granted on 2015-03-10Carrier bonding and detaching processes for a semiconductor wafer
#13 | 2013-05-30 ✅ Patent 8,541,883 granted on 2013-09-24Semiconductor device having shielded conductive vias
#14 | 2012-07-12 ✅ Patent 8,643,167 granted on 2014-02-04Semiconductor package with through silicon vias and method for making the same
#15 | 2012-07-12 ✅ Patent 8,853,819 granted on 2014-10-07Semiconductor structure with passive element network and manufacturing method thereof
#16 | 2012-05-24 ✅ Patent 9,024,445 granted on 2015-05-05Semiconductor device having conductive vias and semiconductor package having semiconductor device
#17 | 2012-04-12 ✅ Patent 8,786,098 granted on 2014-07-22Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same
#18 | 2012-03-01 ✅ Patent 8,865,520 granted on 2014-10-21Carrier bonding and detaching processes for a semiconductor wafer
#19 | 2012-03-01 ✅ Patent 8,692,362 granted on 2014-04-08Semiconductor structure having conductive vias and method for manufacturing the same
#20 | 2011-07-21 ✅ Patent 8,373,285 granted on 2013-02-12Chip module
#21 | 2009-08-06 ✅ Patent 7,943,002 granted on 2011-05-17Tool and method for packaging lens module
#22 | 2008-12-04 ✅ Patent 7,682,960 granted on 2010-03-23Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer
#23 | 2008-07-31 ✅ Patent 7,579,672 granted on 2009-08-25Semiconductor package with electromagnetic shielding capabilities
#24 | 2008-03-27 ✅ Patent 7,642,133 granted on 2010-01-05Method of making a semiconductor package and method of making a semiconductor device
#25 | 2007-08-30 ✅ Patent 7,754,980 granted on 2010-07-13Substrate with multilayer plated through hole and method for forming the multilayer plated through hole
#26 | 2006-12-19 ✅ Patent 7,151,308 granted on 2006-12-19Semiconductor chip package
#27 | 2006-06-13 ✅ Patent 7,061,084 granted on 2006-06-13Lead-bond type chip package and manufacturing method thereof
#28 | 2005-12-13 ✅ Patent 6,974,334 granted on 2005-12-13Semiconductor package with connector
#29 | 2005-12-06 ✅ Patent 6,972,489 granted on 2005-12-06Flip chip package with thermometer
#30 | 2005-09-15 ✅ Patent 7,091,607 granted on 2006-08-15Semiconductor package
#31 | 2005-08-23 ✅ Patent 6,933,616 granted on 2005-08-23Multi-chip module packaging device using flip-chip bonding technology
#32 | 2005-08-18 ✅ Patent 7,232,749 granted on 2007-06-19Integrated circuit inductane and the fabrication method thereof
#33 | 2005-08-11 ✅ Patent 7,335,987 granted on 2008-02-26Semiconductor package and method for manufacturing the same
#34 | 2005-05-19 ✅ Patent 7,122,911 granted on 2006-10-17Heat spreader and semiconductor device package having the same
#35 | 2005-04-07 ✅ Patent 7,199,438 granted on 2007-04-03Overmolded optical package
#36 | 2005-03-17 ✅ Patent 7,220,989 granted on 2007-05-22Test apparatus for a semiconductor package
#37 | 2005-03-01 ✅ Patent 6,861,295 granted on 2005-03-01Low-pin-count chip package and manufacturing method thereof
#38 | 2005-02-17 ✅ Patent 7,205,658 granted on 2007-04-17Singulation method used in leadless packaging process
#39 | 2005-02-17 ✅ Patent 7,012,334 granted on 2006-03-14Semiconductor chip with bumps and method for manufacturing the same
#40 | 2005-01-27 ✅ Patent 7,009,302 granted on 2006-03-07Micromachine package and method for manufacturing the same
#41 | 2005-01-04 ✅ Patent 6,838,762 granted on 2005-01-04Water-level package with bump ring
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