Kun-Ching Chen

City:

Tainan

Country:

Taiwan

Published Applications:

Last publication date:

2010-03-25

Top Assignees for applications by Kun-Ching Chen

The entities that hold a legal rights for patent applications filed by inventor Chen Kun-Ching:

Kun-Ching Chen from Tainan, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Process of fabricating a circuit board

Multi-chip package substrate for flip-chip and wire bonding

High frequency substrate comprised of dielectric layers of different dielectric coefficients

Lead-bond type chip package and manufacturing method thereof

InventorID:

6323773 ⎘