Taoyuan
Taiwan
68
2020-04-30
59
2020-07-21
These are the the leading inventors for applications assigned to KINSUS INTERCONNECT TECHNOLOGY CORP.:
KINSUS INTERCONNECT TECHNOLOGY CORP. based in Taoyuan, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Antenna carrier plate structure
#2 | 2020-04-23 ✅ Patent 11,044,806 granted on 2021-06-22Method for manufacturing multi-layer circuit board capable of being applied with electrical testing
#3 | 2019-12-19 ✅ Patent 10,779,418 granted on 2020-09-15Manufacturing method of double layer circuit board
#4 | 2019-08-29 ✅ Patent 10,455,694 granted on 2019-10-22Method for manufacturing a multi-layer circuit board capable of being applied with electrical testing
#5 | 2019-06-20 ✅ Patent 11,495,390 granted on 2022-11-08Buildup board structure
#6 | 2019-06-13 ✅ Patent 10,366,822 granted on 2019-07-30Method of manufacturing winged coil structure
#7 | 2019-05-30 ✅ Patent 10,532,551 granted on 2020-01-14Foil peeling apparatus
#8 | 2019-05-30 ✅ Patent 10,882,296 granted on 2021-01-05Film-peeling apparatus
#9 | 2019-02-21 ✅ Patent 10,548,214 granted on 2020-01-28Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
#10 | 2019-02-21 ✅ Patent 10,334,719 granted on 2019-06-25Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the same
#11 | 2019-01-10 ✅ Patent 10,383,265 granted on 2019-08-13Electromagnetic-interference shielding device
#12 | 2018-11-15 ✅ Patent 10,779,405 granted on 2020-09-15Landless multilayer circuit board and manufacturing method thereof
#13 | 2018-10-18 ✅ Patent 10,104,817 granted on 2018-10-16Electromagnetic-interference shielding device and method for manufacturing the same
#14 | 2018-05-10 ✅ Patent 10,405,423 granted on 2019-09-03Multi-layer circuit board
#15 | 2018-05-10 ✅ Patent 10,440,837 granted on 2019-10-08Manufacturing method of double layer circuit board
#16 | 2018-03-08 ✅ Patent 10,256,030 granted on 2019-04-09Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure
#17 | 2018-02-20 ✅ Patent 9,901,016 granted on 2018-02-20Electromagnetic-interference shielding device
#18 | 2017-11-02 ✅ Patent 9,967,975 granted on 2018-05-08Multi-layer circuit board
#19 | 2017-10-26 ✅ Patent 10,440,836 granted on 2019-10-08Double layer circuit board
#20 | 2017-10-19 ✅ Patent 10,039,185 granted on 2018-07-31Manufacturing method of landless multilayer circuit board
#21 | 2017-10-19 ✅ Patent 10,371,719 granted on 2019-08-06Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
#22 | 2017-10-05 ✅ Patent 10,256,028 granted on 2019-04-09Buildup board structure
#23 | 2017-04-13 ✅ Patent 9,847,165 granted on 2017-12-19Winged coil structure and method of manufacturing the same
#24 | 2017-02-02 ✅ Patent 9,570,227 granted on 2017-02-14Magnetic excitation coil structure
#25 | 2016-12-22 ✅ Patent 9,744,624 granted on 2017-08-29Method for manufacturing circuit board
#26 | 2016-09-08 ✅ Patent 9,439,292 granted on 2016-09-06Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
#27 | 2016-09-06 ✅ Patent 9,439,290 granted on 2016-09-06Carrier board structure
#28 | 2016-03-29 ✅ Patent 9,301,405 granted on 2016-03-29Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole
#29 | 2015-11-24 ✅ Patent 9,198,296 granted on 2015-11-24Double sided board with buried element and method for manufacturing the same
#30 | 2015-10-01 ✅ Patent 9,370,110 granted on 2016-06-14Method of manufacturing a multilayer substrate structure for fine line
#31 | 2015-10-01MULTILAYER SUBSTRATE STRUCTURE FOR FINE LINE
#32 | 2015-09-24ENHANCED CHIP BOARD PACKAGE STRUCTURE
#33 | 2015-05-21INSULATION LAYER STRUCTURE
#34 | 2015-02-12 ✅ Patent 9,351,409 granted on 2016-05-24Method of manufacturing a thin support package structure
#35 | 2015-02-12THIN PACKAGE STRUCTURE WITH ENHANCED STRENGTH
#36 | 2015-02-12CHIP BOARD PACKAGE STRUCTURE
#37 | 2015-01-29CIRCUIT BOARD STRUCTURE FOR HIGH FREQUENCY SIGNALS
#38 | 2014-10-02METHOD OF PACKAGING A CHIP AND A SUBSTRATE
#39 | 2014-10-02 ✅ Patent 8,941,224 granted on 2015-01-27Package structure of a chip and a substrate
#40 | 2014-10-02 ✅ Patent 9,095,084 granted on 2015-07-28Stacked multilayer structure
#41 | 2014-10-02 ✅ Patent 9,095,085 granted on 2015-07-28Method of manufacturing a stacked multilayer structure
#42 | 2014-06-26 ✅ Patent 8,837,808 granted on 2014-09-16Method of final defect inspection
#43 | 2014-05-01 ✅ Patent 8,766,102 granted on 2014-07-01Chip support board structure
#44 | 2014-05-01LAMINATE CIRCUIT BOARD STRUCTURE
#45 | 2014-05-01 ✅ Patent 8,875,390 granted on 2014-11-04Method of manufacturing a laminate circuit board
#46 | 2014-05-01 ✅ Patent 8,887,386 granted on 2014-11-18Method of manufacturing a chip support board structure
#47 | 2013-10-17 ✅ Patent 8,858,808 granted on 2014-10-14Method of thin printed circuit board wet process consistency on the same carrier
#48 | 2013-10-01 ✅ Patent 8,547,548 granted on 2013-10-01Final defect inspection system
#49 | 2013-08-29 ✅ Patent 8,754,328 granted on 2014-06-17Laminate circuit board with a multi-layer circuit structure
#50 | 2013-08-29METHOD OF MANUFACTURING A LAMINATE CIRCUIT BOARD WITH A MULTILAYER CIRCUIT STRUCTURE
#51 | 2012-11-20 ✅ Patent 8,312,624 granted on 2012-11-20Method for manufacturing a heat dissipation structure of a printed circuit board
#52 | 2012-09-13 ✅ Patent 8,377,815 granted on 2013-02-19Manufacturing method of a semiconductor load board
#53 | 2011-04-14 ✅ Patent 8,161,639 granted on 2012-04-24Method for fabricating an interlayer conducting structure of an embedded circuitry
#54 | 2011-03-03 ✅ Patent 8,315,063 granted on 2012-11-20Solder pad structure with high bondability to solder ball
#55 | 2010-12-09 ✅ Patent 7,871,892 granted on 2011-01-18Method for fabricating buried capacitor structure
#56 | 2010-08-03 ✅ Patent 7,768,131 granted on 2010-08-03Package structure preventing solder overflow on substrate solder pads
#57 | 2010-07-08 ✅ Patent 8,186,054 granted on 2012-05-29Method of fabricating board having high density core layer and structure thereof
#58 | 2009-12-03 ✅ Patent 8,083,954 granted on 2011-12-27Method for fabricating component-embedded printed circuit board
#59 | 2009-12-03 ✅ Patent 7,805,835 granted on 2010-10-05Method for selectively processing surface tension of solder mask layer in circuit board
#60 | 2009-03-26 ✅ Patent 8,051,558 granted on 2011-11-08Manufacturing method of the embedded passive device
#61 | 2009-01-01 ✅ Patent 8,471,375 granted on 2013-06-25High-density fine line structure and method of manufacturing the same
#62 | 2008-12-25 ✅ Patent 7,875,809 granted on 2011-01-25Method of fabricating board having high density core layer and structure thereof
#63 | 2008-11-20 ✅ Patent 7,573,721 granted on 2009-08-11Embedded passive device structure and manufacturing method thereof
#64 | 2008-10-16 ✅ Patent 7,807,034 granted on 2010-10-05Manufacturing method of non-etched circuit board
#65 | 2008-09-18 ✅ Patent 7,662,662 granted on 2010-02-16Method for manufacturing carrier substrate
#66 | 2008-09-11 ✅ Patent 7,488,675 granted on 2009-02-10Method for fabricating IC board without ring structure
#67 | 2007-10-25 ✅ Patent 7,353,591 granted on 2008-04-08Method of manufacturing coreless substrate
#68 | 2007-07-26 ✅ Patent 7,405,146 granted on 2008-07-29Electroplating method by transmitting electric current from a ball side
Also check out KINSUS INTERCONNECT TECHNOLOGY CORP.'s (Taoyuan, Taiwan) applicant profile with 41 patent applications submitted.
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