Taiwan
8
2006-09-05
8
2006-09-05
These are the the leading inventors for applications assigned to Foxconn Technology Co., Ltd.:
Foxconn Technology Co., Ltd. based in , TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Heat dissipation device having heat pipe
#2 | 2006-04-25 ✅ Patent 7,032,653 granted on 2006-04-25Tower-type heat pipe and method for making the same
#3 | 2006-04-13 ✅ Patent 7,174,955 granted on 2007-02-13Heat sink
#4 | 2006-03-23 ✅ Patent 7,163,050 granted on 2007-01-16Heat dissipating device
#5 | 2006-03-23 ✅ Patent 7,047,640 granted on 2006-05-23Method of manufacturing a heat dissipating device
#6 | 2006-02-16 ✅ Patent 7,142,426 granted on 2006-11-28Heat dissipating device and method for manufacturing it
#7 | 2006-02-16 ✅ Patent 7,163,049 granted on 2007-01-16Cooling fin assembly
#8 | 2005-06-02 ✅ Patent 7,142,430 granted on 2006-11-28Heat dissipating device assembly
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