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Inventor profile of:

WEI DENG

City:

Shenzhen

Country:

China

Published Applications:

8

Last publication date:

2020-05-28

Top Assignees for applications by WEI DENG

The entities that hold a legal rights for patent applications filed by inventor DENG WEI:

HON HAI PRECISION INDUSTRY CO., LTD. 2 Tu-Cheng, Taiwan
HON HAI PRECISION INDUSTRY CO., LTD. 2 Tu-Cheng, New Taipei, Taiwan
HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. 2 Shenzhen City, China
FIH (HONG KONG) LIMITED 2 Kowloon, Hong Kong
HON HAI PRECISION INDUSTRY CO., LTD. 1 New Taipei, Taiwan
SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. 1 Shenzhen, China
Foxconn Technology Co., Ltd. 1 , Taiwan
FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 1 Shenzhen, China
SHENZHEN FUTAHONG PRECISION INDUSTRY CO., LTD. 1 Shenzhen, China
HON HAI PRECISION INDUSTRY CO., LTD. 1 Taipei Hsien, China
Hong Fu Jin Precision Industry (Shen Zhen) Co., Ltd. 1 Shenzhen, Guangdong Province, China
FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD. 1 ShenZhen City, China
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. 1 Shenzhen, Guangdong Province, China

Recent patent applications by DENG WEI

WEI DENG from Shenzhen, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-05-28

US20200170133A1

Housing, electronic device, and method for manufacturing same

#2 | 2020-04-21

US16245458

Housing, method for manufacturing same, and electronic device using same

#3 | 2020-01-23

US20200029450A1

HOUSING AND ELECTRONIC DEVICE USING THE SAME

#4 | 2014-01-30

US20140028163A1

HOUSING AND METHOD FOR MANUFACTURING THE SAME

#5 | 2012-06-07

US20120138438A1

Input key and manufacturing method thereof

#6 | 2011-03-03

US20110050054A1

Device housing

#7 | 2011-03-03

US20110049139A1

Device housing

#8 | 2006-09-05

US11263322

Heat dissipation device having heat pipe

InventorID:

628427 ⎘