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Assignee profile:

Faraday Technology, Inc.

City:

Clayton, Ohio

Country:

United States

Published Applications:

14

Last publication date:

2018-06-28

Patent Grants:

10

Last grant date:

2016-08-02

Top Inventors for applications by Faraday Technology, Inc.

These are the the leading inventors for applications assigned to Faraday Technology, Inc.:

Recent patent applications by Faraday Technology, Inc.

Faraday Technology, Inc. based in Clayton, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-06-28
US20180178302A1
Performing operations; transporting

ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING SUPERCONDUCTIVE RADIO FREQUENCY CAVITIES

 #2 | 2016-02-04 ✅ Patent 9,403,228 granted on 2016-08-02
US20160031026A1
Performing operations; transporting

Method and apparatus for pulsed electrochemical grinding

 #3 | 2015-10-15 ✅ Patent 9,546,101 granted on 2017-01-17
US20150291455A1
Chemistry; metallurgy

Electrolytic system and method for filtering an aqueous particulate suspension

 #4 | 2015-04-30 ✅ Patent 9,987,699 granted on 2018-06-05
US20150114847A1
Performing operations; transporting

Electrochemical system and method for electropolishing hollow metal bodies

 #5 | 2014-01-16 ✅ Patent 9,006,147 granted on 2015-04-14
US20140018244A1
Performing operations; transporting

Electrochemical system and method for electropolishing superconductive radio frequency cavities

 #6 | 2013-08-29
US20130220819A1
Chemistry; metallurgy

ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDS

 #7 | 2012-04-19
US20120091002A1
Performing operations; transporting

ELECTROLYTIC SYSTEM AND METHOD FOR CONCENTRATING AN AQUEOUS PARTICULATE SUSPENSON

 #8 | 2012-04-19 ✅ Patent 9,095,808 granted on 2015-08-04
US20120091000A1
Chemistry; metallurgy

Electrolytic system and method for filtering an aqueous particulate suspension

 #9 | 2011-09-01 ✅ Patent 8,226,804 granted on 2012-07-24
US20110209991A1
Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating

 #10 | 2011-01-27
US20110017608A1
Chemistry; metallurgy

ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES

 #11 | 2009-08-20 ✅ Patent 8,329,006 granted on 2012-12-11
US20090205953A1
Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

 #12 | 2008-02-14 ✅ Patent 7,947,161 granted on 2011-05-24
US20080035475A1
Chemistry; metallurgy

Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes

 #13 | 2007-07-12 ✅ Patent 8,603,315 granted on 2013-12-10
US20070158204A1
Chemistry; metallurgy

Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit

 #14 | 2005-09-22 ✅ Patent 7,553,401 granted on 2009-06-30
US20050205429A1
Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

Also check out Faraday Technology, Inc.'s (Clayton, United States) applicant profile with 1 patent applications submitted.

AssigneeID:

36530 ⎘