🔗 Permalink

Inventor profile of:

E. Jennings Taylor

City:

Troy, Ohio

Country:

United States

Published Applications:

Last publication date:

2020-11-05

Top Assignees for applications by E. Jennings Taylor

The entities that hold a legal rights for patent applications filed by inventor Taylor E. Jennings:

Faraday Technology, Inc. 13 Clayton, OH United States
Faraday Technology, Inc. 4 Englewood, OH United States
Faraday Technology Marketing Group, LLC 3 Troy, OH United States
Algaeventure Systems 2 Marysville, OH United States
Physical Sciences, Inc. 2 Andover, MA United States
The United States of America as Represented by the Secretary of the Air Force 1 Washington, DC United States

Recent patent applications by Taylor E. Jennings

E. Jennings Taylor from Troy, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2020-11-05

US20200346953A1

Chemistry; metallurgy

METHOD AND APPARATUS FOR ELECTROCHEMICAL DEWATERING OF SUSPENSIONS OF CELLULOSIC NANOMATERIALS

#2 | 2020-01-23

US20200026138A1

Physics

Electrochemical mirror system and method

#3 | 2019-04-18

US20190112720A1

Chemistry; metallurgy

PULSED CURRENT CATALYZED GAS DIFFUSION ELECTRODES FOR HIGH RATE, EFFICIENT CO2 CONVERSION REACTORS

#4 | 2018-08-16

US20180230621A1

Chemistry; metallurgy

Apparatus for recovery of material generated during electrochemical material removal in acidic electrolytes

#5 | 2018-06-28

US20180178302A1

Performing operations; transporting

ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING SUPERCONDUCTIVE RADIO FREQUENCY CAVITIES

#6 | 2016-08-11

US20160230303A1

Chemistry; metallurgy

Apparatus and method for recovery of material generated during electrochemical material removal in acidic electrolytes

#7 | 2016-02-04

US20160031026A1

Performing operations; transporting

Method and apparatus for pulsed electrochemical grinding

#8 | 2015-10-15

US20150291455A1

Chemistry; metallurgy

Electrolytic system and method for filtering an aqueous particulate suspension

#9 | 2015-04-30

US20150114847A1

Performing operations; transporting

Electrochemical system and method for electropolishing hollow metal bodies

#10 | 2014-01-16

US20140018244A1

Performing operations; transporting

Electrochemical system and method for electropolishing superconductive radio frequency cavities

#11 | 2012-04-19

US20120091002A1

Performing operations; transporting

ELECTROLYTIC SYSTEM AND METHOD FOR CONCENTRATING AN AQUEOUS PARTICULATE SUSPENSON

#12 | 2012-04-19

US20120091000A1

Chemistry; metallurgy

Electrolytic system and method for filtering an aqueous particulate suspension

#13 | 2011-12-15

US20110303553A1

Performing operations; transporting

ELECTROCHEMICAL SYSTEM AND METHOD FOR MACHINING STRONGLY PASSIVATING METALS

#14 | 2011-09-01

US20110209991A1

Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating

#15 | 2011-01-27

US20110017608A1

Chemistry; metallurgy

ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES

#16 | 2009-08-20

US20090205953A1

Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

#17 | 2008-02-14

US20080035475A1

Chemistry; metallurgy

Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes

#18 | 2007-07-12

US20070158204A1

Chemistry; metallurgy

Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit

#19 | 2006-09-21

US20060207888A1

Electricity

Electrochemical etching of circuitry for high density interconnect electronic modules

#20 | 2006-04-04

US10459105

Electrolytic etching of metal layers

#21 | 2005-09-22

US20050205429A1

Chemistry; metallurgy

Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating

#22 | 2005-07-07

US20050145506A1

Chemistry; metallurgy

Electrochemical etching of circuitry for high density interconnect electronic modules

#23 | 2005-04-12

US9823751

Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates

#24 | 2005-03-08

US9823750

Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes

InventorID:

615075 ⎘