WIRE TECHNOLOGY CO., LTD.

City:

Taichung City

Country:

Taiwan

Published Applications:

Last publication date:

2015-07-09

Patent Grants:

Last grant date:

2016-08-23

Top Inventors for applications by WIRE TECHNOLOGY CO., LTD.

These are the the leading inventors for applications assigned to WIRE TECHNOLOGY CO., LTD.:

Hsing-Hua TSAI 4 Taichung City, Taiwan
Jun-Der Lee 4 Taichung City, Taiwan
Jun-Der LEE 2 , United States
Tung-Han Chuang 2 Taipei City, Taiwan

Tung-Han CHUANG 2 Taichung City, Taiwan
Jun-Der Lee 2 Taichung, Taiwan
Tung-Han Chuang 2 Taipei, Taiwan
Hsing-Hua Tsai 2 Taichung, Taiwan

Recent patent applications by WIRE TECHNOLOGY CO., LTD.

WIRE TECHNOLOGY CO., LTD. based in Taichung City, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-07-09 ✅ Patent 9,425,168 granted on 2016-08-23

US20150194409A1

Electricity

Stud bump and package structure thereof and method of manufacturing the same

#2 | 2014-05-08 ✅ Patent 9,490,147 granted on 2016-11-08

US20140124920A1

Electricity

Stud bump structure and method for manufacturing the same

#3 | 2013-09-12

US20130233594A1

Electricity

COMPOSITE WIRE OF SILVER-GOLD-PALLADIUM ALLOY COATED WITH METAL THIN FILM AND METHOD THEREOF

#4 | 2013-09-12

US20130233593A1

Electricity

COMPOSITE WIRE OF SILVER-PALLADIUM ALLOY COATED WITH METALLIC THIN FILM AND METHOD THEREOF

AssigneeID:

38185 ⎘