Jun-Der Lee

City:

Taichung

Country:

Taiwan

Published Applications:

Last publication date:

2015-07-09

Top Assignees for applications by Jun-Der Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Jun-Der:

Jun-Der Lee from Taichung, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Stud bump and package structure thereof and method of manufacturing the same

Copper-based alloy wire and methods for manufaturing the same

Stud bump structure and method for manufacturing the same

Alloy wire and methods for manufacturing the same

InventorID:

6351144 ⎘