Nippon Mining & Metals Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2007-06-12

Patent Grants:

Last grant date:

2007-06-12

Top Inventors for applications by Nippon Mining & Metals Co., Ltd.

These are the the leading inventors for applications assigned to Nippon Mining & Metals Co., Ltd.:

Hideyuki Takahashi 1 Ibaraki, Japan
Akihiro Aiba 1 Ibaraki, Japan
Hirohito Miyashita 1 Ibaraki, Japan
Ryo Suzuki 1 Ibaraki, Japan

Ichiroh Sawamura 1 Ibaraki, Japan
Yuichiro Nakamura 1 Ibaraki, Japan
Takeo Okabe 1 Ibaraki, Japan
Junnosuke Sekiguchi 1 Ibaraki, Japan

Recent patent applications by Nippon Mining & Metals Co., Ltd.

Nippon Mining & Metals Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-06-12 ✅ Patent 7,229,510 granted on 2007-06-12

US10474451

Manganese alloy sputtering target and method for producing the same

#2 | 2006-11-21 ✅ Patent 7,138,040 granted on 2006-11-21

US10362152

Electrolytic copper plating method, phosphorous copper anode for electrolytic plating method, and semiconductor wafer having low particle adhesion plated with said method and anode

#3 | 2006-10-03 ✅ Patent 7,115,193 granted on 2006-10-03

US10467809

Sputtering target producing very few particles, backing plate or apparatus within sputtering device and roughening method by electric discharge machining

#4 | 2006-04-06 ✅ Patent 7,252,794 granted on 2007-08-07

US20060071197A1

Chemistry; metallurgy

Electroconductive oxide sintered compact, sputtering target comprising the sintered compact and methods for producing them

AssigneeID:

398112 ⎘