Beijing
China
27
2017-02-16
21
2019-07-09
These are the the leading inventors for applications assigned to Beijing NMC Co., Ltd.:
Beijing NMC Co., Ltd. based in Beijing, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Mechanical chuck and plasma machining device
#2 | 2017-01-12 ✅ Patent 10,854,482 granted on 2020-12-01Reaction chamber and plasma processing apparatus
#3 | 2017-01-12 ✅ Patent 10,381,202 granted on 2019-08-13Magnetron and magnetron sputtering device
#4 | 2017-01-12 ✅ Patent 11,282,680 granted on 2022-03-22Bearing device and plasma processing apparatus
#5 | 2016-11-10CASSETTE POSITIONING DEVICE AND SEMICONDUCTOR PROCESSING APPARATUS
#6 | 2016-11-03 ✅ Patent 10,297,477 granted on 2019-05-21Chamber
#7 | 2016-11-03 ✅ Patent 10,347,470 granted on 2019-07-09Process chamber and semiconductor processing apparatus
#8 | 2015-10-29 ✅ Patent 9,478,439 granted on 2016-10-25Substrate etching method
#9 | 2015-10-08 ✅ Patent 10,428,424 granted on 2019-10-01Tray device, reaction chamber and MOCVD apparatus
#10 | 2014-12-11 ✅ Patent 9,187,319 granted on 2015-11-17Substrate etching method and substrate processing device
#11 | 2014-11-13 ✅ Patent 9,540,732 granted on 2017-01-10Plasma processing equipment and gas distribution apparatus thereof
#12 | 2014-05-08 ✅ Patent 8,906,753 granted on 2014-12-09Semiconductor structure and method for manufacturing the same
#13 | 2013-10-24 ✅ Patent 9,399,817 granted on 2016-07-26Magnetron source, magnetron sputtering apparatus and magnetron sputtering method
#14 | 2013-10-17 ✅ Patent 10,287,686 granted on 2019-05-14Hot plate and substrate processing equipment using the same
#15 | 2013-10-03 ✅ Patent 10,984,993 granted on 2021-04-20Plasma processing apparatus
#16 | 2013-10-03METHOD FOR APPLYING POWER TO TARGET MATERIAL, POWER SUPPLY FOR TARGET MATERIAL, AND SEMICONDUCTOR PROCESSING APPARATUS
#17 | 2012-12-20 ✅ Patent 8,546,910 granted on 2013-10-01Semiconductor structure and method for manufacturing the same
#18 | 2012-12-13SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#19 | 2012-12-13SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#20 | 2012-08-09ELECTROSTATIC CHUCK AND METHOD FOR REMOVING REMAINING CHARGES THEREON
#21 | 2012-06-07DEEP-TRENCH SILICON ETCHING AND GAS INLET SYSTEM THEREOF
#22 | 2011-10-06 ✅ Patent 8,547,021 granted on 2013-10-01Plasma processing apparatus
#23 | 2011-07-07 ✅ Patent 9,728,379 granted on 2017-08-08Plasma processing apparatus
#24 | 2010-11-11 ✅ Patent 8,217,579 granted on 2012-07-10Device and method for controlling DC bias of RF discharge system
#25 | 2010-11-04 ✅ Patent 8,888,949 granted on 2014-11-18Plasma processing equipment and gas distribution apparatus thereof
#26 | 2010-02-18 ✅ Patent 8,154,721 granted on 2012-04-10Method of online predicting maintenance of an apparatus
#27 | 2009-12-24 ✅ Patent 9,552,965 granted on 2017-01-24Inductively coupled coil and inductively coupled plasma device using the same
Also check out BEIJING NMC CO., LTD.'s (Beijing, China) applicant profile with 3 patent applications submitted.
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