Endicott Interconect Technologies, Inc.

City:

Endicott, New York

Country:

United States

Published Applications:

Last publication date:

2007-01-11

Patent Grants:

Last grant date:

2008-11-11

Top Inventors for applications by Endicott Interconect Technologies, Inc.

These are the the leading inventors for applications assigned to Endicott Interconect Technologies, Inc.:

John M. Lauffer 2 Waverly, NY United States
Voya R. Markovich 2 Endwell, NY United States
Rabindra N. Das 2 Ithaca, NY United States
Roy H. Magnuson 1 Endicott, NY United States

How T. Lin 1 Vestal, NY United States

Recent patent applications by Endicott Interconect Technologies, Inc.

Endicott Interconect Technologies, Inc. based in Endicott, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-01-11 ✅ Patent 7,449,381 granted on 2008-11-11

US20070010065A1

Electricity

Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

#2 | 2007-01-11 ✅ Patent 7,442,879 granted on 2008-10-28

US20070007033A1

Electricity

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

AssigneeID:

410040 ⎘