Inventor profile of:

Rabindra N. Das

City:

Ithaca, New York

Country:

United States

Published Applications:

8

Last publication date:

2009-08-20

Top Assignees for applications by Rabindra N. Das

The entities that hold a legal rights for patent applications filed by inventor Das Rabindra N.:

Recent patent applications by Das Rabindra N.

Rabindra N. Das from Ithaca, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2009-08-20
US20090206051A1
Electricity

Capacitive substrate and method of making same

#2 | 2008-06-26
US20080151515A1
Electricity

Method of making circuitized substrate with a resistor

#3 | 2007-11-29
US20070275525A1
Electricity

Capacitive substrate

#4 | 2007-01-11
US20070010065A1
Electricity

Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

#5 | 2007-01-11
US20070010064A1
Electricity

Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate

#6 | 2007-01-11
US20070007033A1
Electricity

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

#7 | 2006-07-13
US20060154434A1
Electricity

Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate

#8 | 2006-07-13
US20060151202A1
Electricity

Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate

InventorID:

4006628 ⎘