Hsinchu County
Taiwan
78
2025-03-13
62
2026-06-09
These are the the leading inventors for applications assigned to SUBTRON TECHNOLOGY CO., LTD.:
SUBTRON TECHNOLOGY CO., LTD. based in Hsinchu County, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SUBSTRATE STRUCTURE
#2 | 2023-12-28SUBSTRATE STRUCTURE
#3 | 2023-12-14HEAT DISSIPATION SUBSTRATE
#4 | 2023-03-02PACKAGE CARRIER AND PACKAGE STRUCTURE
#5 | 2022-05-19SUBSTRATE STRUCTURE
#6 | 2021-12-09 ✅ Patent 11,764,451 granted on 2023-09-19Waveguide structure
#7 | 2021-04-01OPTICAL WAVEGUIDE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
#8 | 2021-02-18 ✅ Patent 11,171,072 granted on 2021-11-09Heat dissipation substrate and manufacturing method thereof
#9 | 2020-09-24 ✅ Patent 10,957,614 granted on 2021-03-23Heat dissipation substrate and fabricating method thereof
#10 | 2018-12-06 ✅ Patent 10,798,822 granted on 2020-10-06Method of manufacturing a component embedded package carrier
#11 | 2018-04-26 ✅ Patent 10,177,067 granted on 2019-01-08Manufacturing method of package carrier
#12 | 2018-03-29 ✅ Patent 10,319,610 granted on 2019-06-11Package carrier
#13 | 2018-01-25 ✅ Patent 10,297,517 granted on 2019-05-21Manufacturing method of package carrier
#14 | 2017-10-26 ✅ Patent 9,883,594 granted on 2018-01-30Substrate structure for packaging chip
#15 | 2017-08-31 ✅ Patent 10,123,413 granted on 2018-11-06Package substrate and manufacturing method thereof
#16 | 2017-07-20 ✅ Patent 9,961,784 granted on 2018-05-01Manufacturing method of circuit substrate
#17 | 2017-07-20 ✅ Patent 9,761,515 granted on 2017-09-12Substrate structure
#18 | 2017-03-16 ✅ Patent 9,870,931 granted on 2018-01-16Package carrier and manufacturing method thereof
#19 | 2017-01-12 ✅ Patent 9,591,753 granted on 2017-03-07Circuit board and manufacturing method thereof
#20 | 2016-08-11 ✅ Patent 9,458,540 granted on 2016-10-04Package substrate and manufacturing method thereof
#21 | 2016-07-21 ✅ Patent 9,933,149 granted on 2018-04-03Illumination apparatus
#22 | 2016-07-14 ✅ Patent 9,668,351 granted on 2017-05-30Package carrier and manufacturing method thereof
#23 | 2016-07-07 ✅ Patent 9,510,453 granted on 2016-11-29Package carrier
#24 | 2016-06-16 ✅ Patent 9,648,760 granted on 2017-05-09Substrate structure and manufacturing method thereof
#25 | 2016-06-09 ✅ Patent 9,589,942 granted on 2017-03-07Package structure and manufacturing method thereof
#26 | 2016-06-02 ✅ Patent 9,418,931 granted on 2016-08-16Package structure and manufacturing method thereof
#27 | 2016-03-31 ✅ Patent 9,883,599 granted on 2018-01-30Manufacturing method for multi-layer circuit board having cavity
#28 | 2016-02-18SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME
#29 | 2015-11-26 ✅ Patent 9,538,647 granted on 2017-01-03Substrate structure and manufacturing method thereof
#30 | 2015-10-29 ✅ Patent 9,313,886 granted on 2016-04-12Substrate structure and manufacturing method thereof
#31 | 2015-10-15SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#32 | 2015-07-30 ✅ Patent 9,247,632 granted on 2016-01-26Cover structure and manufacturing method thereof
#33 | 2015-07-09 ✅ Patent 9,282,643 granted on 2016-03-08Core substrate and method for fabricating circuit board
#34 | 2015-06-11 ✅ Patent 9,204,546 granted on 2015-12-01Circuit board and manufacturing method thereof
#35 | 2015-05-28HEAT DISSIPATION SUBSTRATE
#36 | 2015-05-21HEAT DISSIPATION DEVICE
#37 | 2015-04-30SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
#38 | 2015-04-02 ✅ Patent 9,433,099 granted on 2016-08-30Package carrier
#39 | 2015-04-02 ✅ Patent 9,236,364 granted on 2016-01-12Package carrier and manufacturing method thereof
#40 | 2015-04-02 ✅ Patent 9,578,750 granted on 2017-02-21Package carrier and manufacturing method thereof
#41 | 2015-03-12 ✅ Patent 9,204,560 granted on 2015-12-01Manufacturing method of package carrier
#42 | 2014-11-27HEAT DISSIPATION PLATE
#43 | 2014-10-30 ✅ Patent 9,532,494 granted on 2016-12-27Manufacturing method of package structure
#44 | 2014-10-02 ✅ Patent 9,041,166 granted on 2015-05-26Manufacturing method of circuit structure
#45 | 2014-08-14 ✅ Patent 9,491,894 granted on 2016-11-08Manufacturing method of cover structure
#46 | 2014-07-31METHOD FOR BONDING HEAT-CONDUCTING SUBSTRATE AND METAL LAYER
#47 | 2014-06-19OPTICAL TOUCH SENSING STRUCTURE
#48 | 2014-05-29 ✅ Patent 8,859,908 granted on 2014-10-14Package carrier
#49 | 2014-04-10 ✅ Patent 8,740,044 granted on 2014-06-03Method for bonding heat-conducting substrate and metal layer
#50 | 2014-04-10 ✅ Patent 9,131,635 granted on 2015-09-08Manufacturing method of substrate structure
#51 | 2014-02-13PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
#52 | 2014-01-02 ✅ Patent 8,973,258 granted on 2015-03-10Manufacturing method of substrate structure
#53 | 2013-12-05 ✅ Patent 8,853,102 granted on 2014-10-07Manufacturing method of circuit structure
#54 | 2013-10-31 ✅ Patent 8,766,463 granted on 2014-07-01Package carrier
#55 | 2013-10-17 ✅ Patent 8,587,115 granted on 2013-11-19Heat dissipation substrate and manufacturing method thereof
#56 | 2013-10-17 ✅ Patent 8,704,101 granted on 2014-04-22Package carrier and manufacturing method thereof
#57 | 2013-10-03 ✅ Patent 8,669,142 granted on 2014-03-11Method of manufacturing package structure
#58 | 2013-10-03 ✅ Patent 8,845,909 granted on 2014-09-30Process of fabricating heat dissipation substrate
#59 | 2013-08-15 ✅ Patent 8,939,188 granted on 2015-01-27Edge separation equipment and operating method thereof
#60 | 2013-07-04 ✅ Patent 9,330,941 granted on 2016-05-03Package carrier and manufacturing method thereof
#61 | 2013-05-30 ✅ Patent 8,746,308 granted on 2014-06-10Manufacturing method of package carrier
#62 | 2013-04-18 ✅ Patent 8,893,379 granted on 2014-11-25Manufacturing method of package structure
#63 | 2013-04-18 ✅ Patent 8,991,043 granted on 2015-03-31Manufacturing method of a circuit board structure
#64 | 2013-01-10 ✅ Patent 8,563,363 granted on 2013-10-22Fabricating method of semiconductor package structure
#65 | 2012-11-22 ✅ Patent 8,541,881 granted on 2013-09-24Package structure and manufacturing method thereof
#66 | 2012-11-22 ✅ Patent 8,384,216 granted on 2013-02-26Package structure and manufacturing method thereof
#67 | 2012-11-15 ✅ Patent 8,737,081 granted on 2014-05-27Cover structure and manufacturing method thereof
#68 | 2012-11-08 ✅ Patent 8,552,303 granted on 2013-10-08Circuit structure and manufacturing method thereof
#69 | 2012-11-08 ✅ Patent 8,803,295 granted on 2014-08-12Circuit structure and manufacturing method thereof
#70 | 2012-11-08 ✅ Patent 9,153,521 granted on 2015-10-06Method of manufacturing a package carrier
#71 | 2012-11-08 ✅ Patent 8,420,951 granted on 2013-04-16Package structure
#72 | 2012-11-08 ✅ Patent 8,513,530 granted on 2013-08-20Package carrier and manufacturing method thereof
#73 | 2012-11-08 ✅ Patent 9,603,263 granted on 2017-03-21Manufacturing method of circuit substrate
#74 | 2012-08-09 ✅ Patent 8,441,121 granted on 2013-05-14Package carrier and manufacturing method thereof
#75 | 2012-07-19 ✅ Patent 8,415,780 granted on 2013-04-09Package carrier and manufacturing method thereof
#76 | 2012-07-19 ✅ Patent 8,624,388 granted on 2014-01-07Package carrier and manufacturing method thereof
#77 | 2012-07-19PACKAGE CARRIER
#78 | 2012-03-22THERMAL CONDUCTIVITY SUBSTRATE AND MANUFACTURING METHOD THEREOF
Also check out Subtron Technology Co., Ltd.'s (Hsinchu County, Taiwan) applicant profile with 25 patent applications submitted.
41338 ⎘