Nihon Superior Sha Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2010-12-09

Patent Grants:

Last grant date:

2013-10-15

Top Inventors for applications by Nihon Superior Sha Co., Ltd.

These are the the leading inventors for applications assigned to Nihon Superior Sha Co., Ltd.:

Tetsuro Nishimura 6 Osaka, Japan

Recent patent applications by Nihon Superior Sha Co., Ltd.

Nihon Superior Sha Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2010-12-09 ✅ Patent 8,557,021 granted on 2013-10-15

US20100307292A1

Chemistry; metallurgy

Method of regulating nickel concentration in lead-free solder containing nickel

#2 | 2010-10-21 ✅ Patent 8,999,519 granted on 2015-04-07

US20100266870A1

Chemistry; metallurgy

Solder joint

#3 | 2010-01-14 ✅ Patent 8,147,746 granted on 2012-04-03

US20100007068A1

Chemistry; metallurgy

Apparatus for precipitation/separation of excess copper in lead-free solder

#4 | 2009-11-26 ✅ Patent 7,861,909 granted on 2011-01-04

US20090289102A1

Performing operations; transporting

Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath

#5 | 2009-11-12 ✅ Patent 8,163,061 granted on 2012-04-24

US20090277302A1

Chemistry; metallurgy

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

#6 | 2008-09-11 ✅ Patent 7,591,873 granted on 2009-09-22

US20080216605A1

Chemistry; metallurgy

Method of copper precipitation in lead-free solder, granulation and separation of (CuX)Sncompounds and recovery of tin

AssigneeID:

419225 ⎘