3D Plus

City:

Country:

France

Published Applications:

Last publication date:

2010-11-04

Patent Grants:

Last grant date:

2012-03-20

Top Inventors for applications by 3D Plus

These are the the leading inventors for applications assigned to 3D Plus:

3D Plus based in , FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

Method of interconnecting electronic wafers

Process for the collective fabrication of 3D electronic modules

Process for the collective fabrication of 3D electronic modules

Low-thickness electronic module comprising a stack of electronic packages provided with connection balls

AssigneeID:

435853 ⎘