Eiko Enterprise Co., Ltd.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2019-04-18

Patent Grants:

Last grant date:

2021-04-06

Top Inventors for applications by Eiko Enterprise Co., Ltd.

These are the the leading inventors for applications assigned to Eiko Enterprise Co., Ltd.:

Takesaburou Ootani 2 Osaka, Japan
Akira EBOSHIDA 1 Hiroshima-shi, Hiroshima, Japan
Akira Eboshida 1 Hiroshima, Japan
Hisayuki Mori 1 Osaka, Japan

Takesaburou OOTANI 1 Osaka-shi, Osaka, Japan
Yoshinori TATSUMI 1 Osaka-shi, Osaka, Japan
Yoshinori Tatsumi 1 Osaka, Japan

Recent patent applications by Eiko Enterprise Co., Ltd.

Eiko Enterprise Co., Ltd. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-04-18 ✅ Patent 10,967,581 granted on 2021-04-06

US20190111631A1

Performing operations; transporting

Rubber core cord joining structure, and solidifying agent for joining rubber core cord

#2 | 2010-09-09 ✅ Patent 8,192,378 granted on 2012-06-05

US20100228169A1

Human necessities

Toe massage device

Also check out EIKO ENTERPRISE CO., LTD's (Osaka, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

452876 ⎘