Akira Eboshida

City:

Hiroshima

Country:

Japan

Published Applications:

Last publication date:

2019-04-18

Top Assignees for applications by Akira Eboshida

The entities that hold a legal rights for patent applications filed by inventor Eboshida Akira:

Akira Eboshida from Hiroshima, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Rubber core cord joining structure, and solidifying agent for joining rubber core cord

InventorID:

6538946 ⎘