STAT ChipPAC, Ltd.

City:

Singapore

Country:

Singapore

Published Applications:

Last publication date:

2012-12-27

Patent Grants:

Last grant date:

2013-05-07

Top Inventors for applications by STAT ChipPAC, Ltd.

These are the the leading inventors for applications assigned to STAT ChipPAC, Ltd.:

OhHan Kim 1 Kyonggi-do, South Korea
Won Kyoung Choi 1 Singapore, Singapore
Frederick Rodriguez Dahilig 1 Singapore, Singapore
DongSoo Moo 1 Kyonggi-do, South Korea

Pandi Chelvam Marimuthu 1 Singapore, Singapore
Zigmund Ramirez Camacho 1 Singapore, Singapore
SungWon Cho 1 Kyoung-gi-Do, South Korea
DaeSik Choi 1 Seoul, South Korea

Henry Descalzo Bathan 1 Singapore, Singapore
KyuWon Lee 1 Kyoungki-Do, South Korea

Recent patent applications by STAT ChipPAC, Ltd.

STAT ChipPAC, Ltd. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-12-27 ✅ Patent 8,435,881 granted on 2013-05-07

US20120326297A1

Electricity

Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation

#2 | 2012-08-23 ✅ Patent 8,273,604 granted on 2012-09-25

US20120211892A1

Electricity

Semiconductor device and method of forming WLCSP structure using protruded MLP

#3 | 2010-12-16 ✅ Patent 8,810,015 granted on 2014-08-19

US20100314731A1

Electricity

Integrated circuit packaging system with high lead count and method of manufacture thereof

AssigneeID:

456856 ⎘