Wire Technology Co., Ltd.

City:

Taichung

Country:

Taiwan

Published Applications:

Last publication date:

2015-07-09

Patent Grants:

Last grant date:

2016-08-23

Top Inventors for applications by Wire Technology Co., Ltd.

These are the the leading inventors for applications assigned to Wire Technology Co., Ltd.:

Hsing-Hua TSAI 3 Taichung City, Taiwan
Jun-Der Lee 3 Taichung City, Taiwan
Hsing-Hua Tsai 3 Taichung, Taiwan
Jun-Der Lee 3 Taichung, Taiwan

Tung-Han Chuang 2 Taipei, Taiwan
Tung-Han Chuang 2 Taipei City, Taiwan
Tung-Han CHUANG 1 Taichung City, Taiwan
Tung-Han Chuang 1 Taichung, Taiwan

Recent patent applications by Wire Technology Co., Ltd.

Wire Technology Co., Ltd. based in Taichung, TW has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-07-09 ✅ Patent 9,425,168 granted on 2016-08-23

US20150194409A1

Electricity

Stud bump and package structure thereof and method of manufacturing the same

#2 | 2014-05-08 ✅ Patent 9,490,147 granted on 2016-11-08

US20140124920A1

Electricity

Stud bump structure and method for manufacturing the same

#3 | 2013-07-04 ✅ Patent 8,940,403 granted on 2015-01-27

US20130171470A1

Performing operations; transporting

Alloy wire and methods for manufacturing the same

Also check out WIRE TECHNOLOGY CO., LTD.'s (Taichung, Taiwan) applicant profile with 2 patent applications submitted.

AssigneeID:

488955 ⎘