Germany
12
2022-07-21
12
2024-06-11
These are the the leading inventors for applications assigned to SUSS MicroTec Lithography GmbH:
SUSS MicroTec Lithography GmbH based in , DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Bonding device as well as method for bonding substrates
#2 | 2020-11-12 ✅ Patent 12,172,344 granted on 2024-12-24Stamp replication device and method for producing a holding means for a stamp replication device as well as a stamp
#3 | 2018-08-02 ✅ Patent 10,259,124 granted on 2019-04-16Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector
#4 | 2018-08-02 ✅ Patent 10,343,292 granted on 2019-07-09End effector
#5 | 2017-01-19 ✅ Patent 9,958,795 granted on 2018-05-01Spacer displacement device for a wafer illumination unit and wafer illumination unit
#6 | 2016-10-20 ✅ Patent 9,960,061 granted on 2018-05-01Method and device for curing at least in part a photoresist applied to a substrate
#7 | 2016-10-13 ✅ Patent 9,799,554 granted on 2017-10-24Method for coating a substrate
#8 | 2016-10-13 ✅ Patent 9,583,374 granted on 2017-02-28Debonding temporarily bonded semiconductor wafers
#9 | 2016-10-06 ✅ Patent 9,864,277 granted on 2018-01-09Method for regulating a light source of a photolithography exposure system and exposure assembly for a photolithography device
#10 | 2015-10-15 ✅ Patent 9,824,909 granted on 2017-11-21Chuck, in particular for use in a mask aligner
#11 | 2014-10-30 ✅ Patent 9,859,141 granted on 2018-01-02Apparatus and method for aligning and centering wafers
#12 | 2014-10-30 ✅ Patent 9,837,295 granted on 2017-12-05Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
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