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Inventor profile of:

HALE JOHNSON

City:

JERICHO, Vermont

Country:

United States

Published Applications:

Last publication date:

2021-01-14

Top Assignees for applications by HALE JOHNSON

The entities that hold a legal rights for patent applications filed by inventor JOHNSON HALE:

SUSS MICROTEC LITHOGRAPHY GMBH 14 Garching, Germany
SUSS MICROTEC INC 4 WATERBURY, VT United States
SUSS MICROTEC AG 3 GARCHING/MUNICH, Germany
SUSS MicroTec Lithography GmbH 2 , Germany
SUSS MICROTEC INC 1 Waterbury Center, VT United States
Suss Microtec AG 1 Garching, Munich, Germany
SUSS MicroTech Lithography GmbH 1 Garching, Germany

Recent patent applications by JOHNSON HALE

HALE JOHNSON from JERICHO, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-01-14

US20210013079A1

Electricity

Apparatus, system, and method for handling aligned wafer pairs

#2 | 2018-04-19

US20180108547A1

Electricity

Semiconductor bonding apparatus and related techniques

#3 | 2018-04-12

US20180102270A1

Electricity

Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing

#4 | 2017-12-28

US20170372925A1

Electricity

System and related techniques for handling aligned substrate pairs

#5 | 2017-08-24

US20170243769A1

Electricity

Semiconductor bonding apparatus and related techniques

#6 | 2016-11-17

US20160336212A1

Electricity

Apparatus, system, and method for handling aligned wafer pairs

#7 | 2016-11-17

US20160336208A1

Electricity

Apparatus, system, and method for handling aligned wafer pairs

#8 | 2015-07-23

US20150206783A1

Electricity

SYSTEM AMD METHOD FOR SUBSTRATE HOLDING

#9 | 2015-03-26

US20150083342A1

Electricity

Method for thermal-slide debonding of temporary bonded semiconductor wafers

#10 | 2014-10-30

US20140319786A1

Electricity

Apparatus and method for aligning and centering wafers

#11 | 2014-10-30

US20140318683A1

Electricity

Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing

#12 | 2011-01-20

US20110014774A1

Electricity

Apparatus for temporary wafer bonding and debonding

#13 | 2011-01-20

US20110010908A1

Electricity

Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers

#14 | 2010-10-21

US20100266373A1

Electricity

Device for centering wafers

#15 | 2010-10-21

US20100263794A1

Electricity

Apparatus for mechanically debonding temporary bonded semiconductor wafers

#16 | 2010-04-15

US20100089978A1

Electricity

METHOD AND APPARATUS FOR WAFER BONDING

#17 | 2008-08-07

US20080188072A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

#18 | 2008-08-07

US20080188070A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

#19 | 2008-08-07

US20080188069A1

Electricity

Apparatus and method for semiconductor wafer bumping via injection molded solder

InventorID:

949177 ⎘