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Assignee profile:

NIHON SUPERIOR CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

Last publication date:

2022-09-22

Patent Grants:

Last grant date:

2026-01-13

Top Inventors for applications by NIHON SUPERIOR CO., LTD.

These are the the leading inventors for applications assigned to NIHON SUPERIOR CO., LTD.:

Tetsuro Nishimura 12 Osaka, Japan
Stuart David McDonald 2 Brisbane, Australia
Tetsuro Nishimura 2 Suita, Japan
Tetsuya AKAIWA 2 Osaka, Japan

Kazuhiro Nogita 2 Brisbane, Australia
Takatoshi Nishimura 2 Tokyo, Japan
Kazuhiro NOGITA 1 Brisbane, QLD, Australia
Jonathan James Read 1 Brisbane, Australia

Masumi Asakawa 1 Ibaraki, Japan
Hideki YOSHIDA 1 Osaka, Japan
Motonori MIYAOKA 1 Osaka, Japan
Stuart David MCDONALD 1 Brisbane, QLD, Australia

Tetsuro Nishimura 1 Suita-shi, Japan
Yutaka FUKUSHIMA 1 Osaka, Japan
Mitsuhiro Kawahara 1 Osaka, Japan
Shoichi SUENAGA 1 Osaka, Japan

Takatoshi NISHIMURA 1 Koto-ku, Tokyo, Japan
Masuml Asakawa 1 Ibaraki, Japan
Tina Ventura 1 Zofingen, Switzerland
Yasufumi SHIBATA 1 Aichi, Japan

Shiqian Liu 1 Brisbane, Australia
Takashi NOZU 1 Osaka, Japan
Shiqian LIU 1 Brisbane, QLD, Australia
Toshimi Shimizu 1 Ibaraki, Japan

Tetsuro Nishimura 1 Suita-shi, Osaka, Japan

Recent patent applications by NIHON SUPERIOR CO., LTD.

NIHON SUPERIOR CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-09-22 ✅ Patent 12,521,822 granted on 2026-01-13

US20220297243A1

Performing operations; transporting

SOLDER PASTE AND SOLDER BONDED BODY

#2 | 2022-09-01 ✅ Patent 12,377,501 granted on 2025-08-05

US20220274212A1

Performing operations; transporting

PREFORMED SOLDER AND SOLDER BONDED BODY FORMED BY USING SAID PREFORMED SOLDER

#3 | 2022-04-07 ✅ Patent 12,172,242 granted on 2024-12-24

US20220105593A1

Performing operations; transporting

Lead-free solder alloy

#4 | 2022-01-20 ✅ Patent 11,839,937 granted on 2023-12-12

US20220016733A1

Performing operations; transporting

Lead-free solder alloy and solder joint part

#5 | 2022-01-13 ✅ Patent 11,980,974 granted on 2024-05-14

US20220009040A1

Performing operations; transporting

Solder joint part and method for manufacturing the same

#6 | 2016-12-29 ✅ Patent 9,999,936 granted on 2018-06-19

US20160375517A1

Performing operations; transporting

Solder wire bobbinless coil

#7 | 2016-02-04 ✅ Patent 10,329,642 granted on 2019-06-25

US20160032424A1

Chemistry; metallurgy

Solder alloy and joint thereof

#8 | 2014-08-14

US20140224861A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME, AND APPARATUS AND SYSTEM THEREFOR

#9 | 2014-02-06 ✅ Patent 9,339,893 granted on 2016-05-17

US20140037369A1

Performing operations; transporting

Lead-free solder alloy

#10 | 2014-01-30 ✅ Patent 9,999,945 granted on 2018-06-19

US20140030140A1

Performing operations; transporting

Solder alloy

#11 | 2012-11-15

US20120286026A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#12 | 2012-11-08

US20120280020A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#13 | 2011-11-10

US20110272454A1

Performing operations; transporting

WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR

#14 | 2011-09-15 ✅ Patent 8,652,269 granted on 2014-02-18

US20110220247A1

Chemistry; metallurgy

Flux composition and soldering paste composition

Also check out NIHON SUPERIOR CO., LTD.'s (Osaka, Japan) applicant profile with 7 patent applications submitted.

AssigneeID:

54091 ⎘