Tokyo
Japan
3
2014-02-20
3
2017-03-21
These are the the leading inventors for applications assigned to LAN TECHNICAL SERVICE CO., LTD.:
LAN TECHNICAL SERVICE CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#2 | 2014-02-06 ✅ Patent 10,166,749 granted on 2019-01-01Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#3 | 2006-09-19 ✅ Patent 7,110,080 granted on 2006-09-19Device for connecting display panel substrates comprising a spacer having a plurality of spacer elements or a rotatable head section for controlling cell gap
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