Ryuichi Kondou

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2018-12-13

Top Assignees for applications by Ryuichi Kondou

The entities that hold a legal rights for patent applications filed by inventor Kondou Ryuichi:

Ryuichi Kondou from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Laminated inductor

Laminated inductor

PASSIVE ELECTRONIC COMPONENT

Laminated inductor

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Method of transferring thin film components and circuit board having the same

InventorID:

641069 ⎘