Kyoto
Japan
21
2026-02-26
13
2025-03-25
These are the the leading inventors for applications assigned to BONDTECH CO., LTD.:
BONDTECH CO., LTD. based in Kyoto, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
SUBSTRATE BONDING SYSTEM AND SUBSTRATE BONDING METHOD
#2 | 2024-09-12BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
#3 | 2024-05-30BONDING SYSTEM AND BONDING METHOD
#4 | 2024-05-16BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
#5 | 2024-03-07 ✅ Patent 12,261,147 granted on 2025-03-25Bonding system and bonding method
#6 | 2024-03-07 ✅ Patent 12,388,045 granted on 2025-08-12BONDING SYSTEM AND BONDING METHOD
#7 | 2024-02-29BONDING METHOD, BONDER, AND BONDING SYSTEM
#8 | 2024-01-11 ✅ Patent 12,409,644 granted on 2025-09-09SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM
#9 | 2023-09-28CHIP BONDING SYSTEM AND CHIP BONDING METHOD
#10 | 2023-05-18 ✅ Patent 12,341,036 granted on 2025-06-24COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVICE, COMPONENT MOUNTING METHOD, AND RESIN SHAPING METHOD FOR MOUNTING A COMPONENT ON A SUBSTRATE
#11 | 2023-05-04 ✅ Patent 11,837,444 granted on 2023-12-05Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device
#12 | 2023-02-02BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
#13 | 2021-10-14 ✅ Patent 12,094,747 granted on 2024-09-17Substrate bonding device
#14 | 2021-10-07 ✅ Patent 12,261,070 granted on 2025-03-25Component mounting system and component mounting method
#15 | 2021-08-26BONDING SYSTEM AND BONDING METHOD
#16 | 2020-01-02 ✅ Patent 11,587,804 granted on 2023-02-21Component mounting system
#17 | 2017-08-03 ✅ Patent 10,580,752 granted on 2020-03-03Method for bonding substrates together, and substrate bonding device
#18 | 2016-03-24 ✅ Patent 9,379,082 granted on 2016-06-28Pressure application apparatus and pressure application method
#19 | 2014-02-20 ✅ Patent 9,601,350 granted on 2017-03-21Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#20 | 2014-02-06 ✅ Patent 10,166,749 granted on 2019-01-01Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
#21 | 2012-05-24 ✅ Patent 9,243,894 granted on 2016-01-26Pressure application apparatus and pressure application method
Also check out BONDTECH CO., LTD.'s (Kyoto, Japan) applicant profile with 14 patent applications submitted.
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