Assignee profile:

SILEX Microsystems AB

City:

Jarfalla

Country:

Sweden

Published Applications:

34

Last publication date:

2016-07-21

Patent Grants:

30

Last grant date:

2017-08-01

Top Inventors for applications by SILEX Microsystems AB

These are the the leading inventors for applications assigned to SILEX Microsystems AB:

Recent patent applications by SILEX Microsystems AB

SILEX Microsystems AB based in Jarfalla, SE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-07-21 ✅ Patent 9,718,674 granted on 2017-08-01
US20160207758A1
Performing operations; transporting

Thin capping for MEMS devices

#2 | 2016-06-16 ✅ Patent 9,613,863 granted on 2017-04-04
US20160172241A1
Electricity

Method for forming electroless metal through via

#3 | 2016-05-05 ✅ Patent 9,620,390 granted on 2017-04-11
US20160122180A1
Performing operations; transporting

Method of making a semiconductor device having a functional capping

#4 | 2016-02-04 ✅ Patent 9,484,293 granted on 2016-11-01
US20160035662A1
Electricity

Semiconductor devices with close-packed via structures having in-plane routing and method of making same

#5 | 2015-12-24 ✅ Patent 9,507,142 granted on 2016-11-29
US20150370063A1
Physics

Precise definition of transducer electrodes

#6 | 2015-10-01 ✅ Patent 9,607,915 granted on 2017-03-28
US20150279756A1
Electricity

Through substrate vias and device

#7 | 2015-09-10 ✅ Patent 9,514,985 granted on 2016-12-06
US20150255344A1
Electricity

Electroless metal through silicon via

#8 | 2015-03-19 ✅ Patent 9,224,681 granted on 2015-12-29
US20150076677A1
Electricity

CTE matched interposer and method of making

#9 | 2015-02-26 ✅ Patent 9,355,895 granted on 2016-05-31
US20150054136A1
Electricity

Method of providing a via hole and routing structure

#10 | 2015-01-29 ✅ Patent 9,190,356 granted on 2015-11-17
US20150028479A1
Electricity

Semiconductor devices with close-packed via structures having in-plane routing and method of making same

#11 | 2014-12-25 ✅ Patent 9,936,918 granted on 2018-04-10
US20140378804A1
Human necessities

Insulation of micro structures

#12 | 2014-11-27 ✅ Patent 9,511,999 granted on 2016-12-06
US20140346657A1
Performing operations; transporting

Thin film capping

#13 | 2014-03-06 ✅ Patent 9,448,401 granted on 2016-09-20
US20140063580A1
Physics

Via structure and method thereof

#14 | 2014-02-13 ✅ Patent 9,249,009 granted on 2016-02-02
US20140042498A1
Performing operations; transporting

Starting substrate for semiconductor engineering having substrate-through connections and a method for making same

#15 | 2012-11-22 ✅ Patent 8,598,676 granted on 2013-12-03
US20120292736A1
Electricity

Barrier structure

#16 | 2012-11-15
US20120288422A1
Chemistry; metallurgy

GLASS MICRO FLUIDIC DEVICE

#17 | 2012-10-25 ✅ Patent 9,362,139 granted on 2016-06-07
US20120267773A1
Electricity

Method of making a semiconductor device having a functional capping

#18 | 2012-05-24 ✅ Patent 8,637,351 granted on 2014-01-28
US20120126392A1
Human necessities

Methods for making micro needles and applications thereof

#19 | 2012-05-10 ✅ Patent 8,866,289 granted on 2014-10-21
US20120112335A1
Electricity

Bonding process and bonded structures

#20 | 2012-04-26 ✅ Patent 8,485,416 granted on 2013-07-16
US20120097733A1
Electricity

Bonding process and bonded structures

#21 | 2012-03-29 ✅ Patent 8,729,685 granted on 2014-05-20
US20120076715A1
Electricity

Bonding process and bonded structures

#22 | 2012-01-26 ✅ Patent 8,630,033 granted on 2014-01-14
US20120019886A1
Physics

Via structure and method thereof

#23 | 2012-01-26 ✅ Patent 8,592,981 granted on 2013-11-26
US20120018898A1
Physics

Via structure and method thereof

#24 | 2012-01-26 ✅ Patent 8,729,713 granted on 2014-05-20
US20120018852A1
Physics

Via structure and method thereof

#25 | 2010-03-04
US20100053922A1
Electricity

MICROPACKAGING METHOD AND DEVICES

#26 | 2010-03-04 ✅ Patent 8,324,103 granted on 2012-12-04
US20100052107A1
Electricity

Vias and method of making

#27 | 2010-01-14 ✅ Patent 8,308,960 granted on 2012-11-13
US20100006536A1
Human necessities

Methods for making micro needles and applications thereof

#28 | 2009-12-10
US20090302414A1
Electricity

TRENCH ISOLATION FOR REDUCED CROSS TALK

#29 | 2009-08-06 ✅ Patent 9,312,217 granted on 2016-04-12
US20090195948A1
Electricity

Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections

#30 | 2008-12-18
US20080308884A1
Performing operations; transporting

Fabrication of Inlet and Outlet Connections for Microfluidic Chips

#31 | 2006-03-28 ✅ Patent 7,017,420 granted on 2006-03-28
US10479802
-

Miniaturized pressure sensor

#32 | 2006-02-16 ✅ Patent 7,207,227 granted on 2007-04-24
US20060032039A1
Physics

Pressure sensor

#33 | 2005-12-13 ✅ Patent 6,973,835 granted on 2005-12-13
US10492612
-

Pressure sensor

#34 | 2005-06-09 ✅ Patent 7,172,911 granted on 2007-02-06
US20050124159A1
Performing operations; transporting

Deflectable microstructure and method of manufacturing the same through bonding of wafers

Also check out SILEX MICROSYSTEMS AB's (Järfälla, Sweden) applicant profile with 10 patent applications submitted.

AssigneeID:

54793 ⎘