Huddinge
Sweden
26
2021-06-03
The entities that hold a legal rights for patent applications filed by inventor Ebefors Thorbjorn:
Thorbjorn Ebefors from Huddinge, SE has applied for patents for these inventions. The list has both pending applications and granted patents:
A DEVICE, SYSTEM AND METHOD FOR GENERATING AN ACOUSTIC-POTENTIAL FIELD OF ULTRASONIC WAVES
#2 | 2016-07-21Thin capping for MEMS devices
#3 | 2016-06-16Method for forming electroless metal through via
#4 | 2016-05-05Method of making a semiconductor device having a functional capping
#5 | 2016-02-04Semiconductor devices with close-packed via structures having in-plane routing and method of making same
#6 | 2015-09-10Electroless metal through silicon via
#7 | 2015-03-19CTE matched interposer and method of making
#8 | 2015-02-26Method of providing a via hole and routing structure
#9 | 2015-01-29Semiconductor devices with close-packed via structures having in-plane routing and method of making same
#10 | 2014-12-25Insulation of micro structures
#11 | 2014-11-27Thin film capping
#12 | 2014-03-06Via structure and method thereof
#13 | 2012-11-22Barrier structure
#14 | 2012-10-25Method of making a semiconductor device having a functional capping
#15 | 2012-05-24Methods for making micro needles and applications thereof
#16 | 2012-05-10Bonding process and bonded structures
#17 | 2012-04-26Bonding process and bonded structures
#18 | 2012-03-29Bonding process and bonded structures
#19 | 2012-01-26Via structure and method thereof
#20 | 2012-01-26Via structure and method thereof
#21 | 2012-01-26Via structure and method thereof
#22 | 2010-03-04MICROPACKAGING METHOD AND DEVICES
#23 | 2010-01-14Methods for making micro needles and applications thereof
#24 | 2009-12-10TRENCH ISOLATION FOR REDUCED CROSS TALK
#25 | 2009-08-06Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
#26 | 2007-01-25Electrical connections in substrates
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