Dow Corning Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2018-07-26

Patent Grants:

Last grant date:

2019-01-01

Top Inventors for applications by Dow Corning Co., Ltd.

These are the the leading inventors for applications assigned to Dow Corning Co., Ltd.:

Ryosuke Yamazaki 1 Ichihara-shi, Japan
Ryosuke Yamazaki 1 Ichihara, Japan
Haruna Yamazaki 1 Ichihara, Japan
Makoto Yoshitake 1 Ichihara, Japan

Makoto Yoshitake 1 Ichihara-shi, Japan
Haruna Yamazaki 1 Ichihara-shi, Japan

Recent patent applications by Dow Corning Co., Ltd.

Dow Corning Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2018-07-26 ✅ Patent 10,167,418 granted on 2019-01-01

US20180208816A1

Chemistry; metallurgy

Hot melt silicone and curable hot melt composition

AssigneeID:

548844 ⎘