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Inventor profile of:

Ryosuke Yamazaki

City:

Ichihara

Country:

Japan

Published Applications:

Last publication date:

2023-05-18

Top Assignees for applications by Ryosuke Yamazaki

The entities that hold a legal rights for patent applications filed by inventor Yamazaki Ryosuke:

DOW TORAY CO., LTD. 11 Tokyo, Japan
DOW CORNING TORAY CO., LTD. 2 Chiyoda-ku, Tokyo, Japan
Dow Corning Co., Ltd. 1 Tokyo, Japan

Recent patent applications by Yamazaki Ryosuke

Ryosuke Yamazaki from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2023-05-18

US20230151215A1

Chemistry; metallurgy

CURABLE HOT-MELT SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE INCLUDING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED PRODUCT THEREOF

#2 | 2023-05-04

US20230137947A1

Chemistry; metallurgy

Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof

#3 | 2022-06-23

US20220195270A1

Chemistry; metallurgy

CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME

#4 | 2022-06-16

US20220186099A1

Chemistry; metallurgy

Curable silicone composition, cured product of same and method for producing same

#5 | 2022-06-02

US20220169894A1

Chemistry; metallurgy

CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR MANUFACTURING SAME

#6 | 2022-03-03

US20220064491A1

Chemistry; metallurgy

Curable silicone composition, cured product thereof, and method for producing same

#7 | 2022-03-03

US20220064447A1

Chemistry; metallurgy

Curable silicone composition, cured product thereof, and method for producing same

#8 | 2022-02-17

US20220048230A1

Performing operations; transporting

Method for producing curable silicone sheet having hot melt properties

#9 | 2021-06-24

US20210189129A1

Chemistry; metallurgy

Curable granular silicone composition, cured object obtained therefrom, and production method therefor

#10 | 2020-12-17

US20200392335A1

Chemistry; metallurgy

Curable granular silicone composition, semiconductor member comprising same, and forming method thereof

#11 | 2019-06-13

US20190177488A1

Chemistry; metallurgy

Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and method for molding semiconductor member

#12 | 2018-07-26

US20180208816A1

Chemistry; metallurgy

Hot melt silicone and curable hot melt composition

#13 | 2015-01-01

US20150001569A1

Chemistry; metallurgy

Curable silicone composition, cured product thereof, and optical semiconductor device

#14 | 2014-12-18

US20140367723A1

Electricity

Curable silicone composition, cured product thereof, and optical semiconductor device

InventorID:

6010940 ⎘