Singapore
Singapore
41
2019-01-31
30
2020-09-01
These are the the leading inventors for applications assigned to ADVANPACK SOLUTIONS PTE LTD.:
ADVANPACK SOLUTIONS PTE LTD. based in Singapore, SG has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Semiconductor structure and semiconductor package device using the same
#2 | 2018-11-08 ✅ Patent 10,446,457 granted on 2019-10-15Multi-layer substrate for semiconductor packaging
#3 | 2017-10-19 ✅ Patent 10,154,588 granted on 2018-12-11Manufacturing method of semiconductor package
#4 | 2016-11-10SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#5 | 2016-10-06 ✅ Patent 9,892,916 granted on 2018-02-13Manufacturing method of package substrate and package manufacturing method of semiconductor device
#6 | 2016-09-15CHIP AND MANUFACTURING METHOD THEREOF
#7 | 2016-06-30 ✅ Patent 9,653,323 granted on 2017-05-16Manufacturing method of substrate structure having embedded interconnection layers
#8 | 2016-04-28 ✅ Patent 9,583,449 granted on 2017-02-28Semiconductor package
#9 | 2016-01-14 ✅ Patent 9,754,899 granted on 2017-09-05Semiconductor structure and method of fabricating the same
#10 | 2015-06-04 ✅ Patent 10,049,950 granted on 2018-08-14Multi-layer substrate for semiconductor packaging
#11 | 2015-04-23 ✅ Patent 9,305,868 granted on 2016-04-05Manufacturing method of forming an etch-back type semiconductor package with locking anchorages
#12 | 2014-10-09 ✅ Patent 9,362,206 granted on 2016-06-07Chip and manufacturing method thereof
#13 | 2014-06-19 ✅ Patent 9,219,027 granted on 2015-12-22Semiconductor device carrier and semiconductor package using the same
#14 | 2013-07-11 ✅ Patent 9,723,717 granted on 2017-08-01Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
#15 | 2013-06-27 ✅ Patent 9,301,391 granted on 2016-03-29Substrate structure, semiconductor package device, and manufacturing method of substrate structure
#16 | 2013-05-09 ✅ Patent 9,379,044 granted on 2016-06-28Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
#17 | 2013-01-24 ✅ Patent 10,109,503 granted on 2018-10-23Method of manufacturing semiconductor package device
#18 | 2012-08-30 ✅ Patent 8,846,519 granted on 2014-09-30Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#19 | 2012-06-21 ✅ Patent 8,796,844 granted on 2014-08-05Package structure
#20 | 2012-06-21 ✅ Patent 8,766,438 granted on 2014-07-01Package structure
#21 | 2012-03-08 ✅ Patent 8,709,874 granted on 2014-04-29Manufacturing method for semiconductor device carrier and semiconductor package using the same
#22 | 2011-11-10 ✅ Patent 9,082,775 granted on 2015-07-14System for encapsulation of semiconductor dies
#23 | 2011-11-03 ✅ Patent 8,917,521 granted on 2014-12-23Etch-back type semiconductor package, substrate and manufacturing method thereof
#24 | 2010-10-21 ✅ Patent 9,287,157 granted on 2016-03-15Semiconductor element for package miniaturization
#25 | 2009-11-26 ✅ Patent 9,269,601 granted on 2016-02-23Method of manufacturing semiconductor element
#26 | 2009-04-23 ✅ Patent 9,396,982 granted on 2016-07-19Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof
#27 | 2008-10-09THERMAL BONDING PROCESS FOR CHIP PACKAGING
#28 | 2008-06-26Device and method for testing semiconductor element, and manufacturing method thereof
#29 | 2008-06-19 ✅ Patent 7,795,071 granted on 2010-09-14Semiconductor package for fine pitch miniaturization and manufacturing method thereof
#30 | 2008-04-17 ✅ Patent 8,207,608 granted on 2012-06-26Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#31 | 2007-12-13INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#32 | 2007-08-23Flip chip in package using flexible and removable leadframe
#33 | 2006-08-17Optical sensor package and method of manufacture
#34 | 2006-08-08 ✅ Patent 7,087,458 granted on 2006-08-08Method for fabricating a flip chip package with pillar bump and no flow underfill
#35 | 2006-05-18Heat sinking structure
#36 | 2006-05-11Structure for high quality factor inductor operation
#37 | 2006-03-23Embedded passive component
#38 | 2005-09-22 ✅ Patent 7,456,496 granted on 2008-11-25Package design and method of manufacture for chip grid array
#39 | 2005-08-16 ✅ Patent 6,929,981 granted on 2005-08-16Package design and method of manufacture for chip grid array
#40 | 2005-08-04Structure package
#41 | 2005-04-14 ✅ Patent 7,462,942 granted on 2008-12-09Die pillar structures and a method of their formation
Also check out ADVANPACK SOLUTIONS PTE LTD.'s (Singapore, Singapore) applicant profile with 14 patent applications submitted.
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