Toho Engineering Co., Ltd.

City:

Yokkaichi-shi

Country:

Japan

Published Applications:

Last publication date:

2019-04-25

Patent Grants:

Last grant date:

2020-05-26

Top Inventors for applications by Toho Engineering Co., Ltd.

These are the the leading inventors for applications assigned to Toho Engineering Co., Ltd.:

Eisuke SUZUKI 4 Yokkaichi-shi, Japan
Daisuke Suzuki 4 Yokkaichi, Japan
Eisuke Suzuki 4 Yokkaichi, Japan
Tatsutoshi SUZUKI 4 Yokkaichi-shi, Japan

Daisuke SUZUKI 4 Yokkaichi-shi, Japan
Tatsutoshi Suzuki 4 Yokkaichi, Japan
Kazuto Yamauchi 3 Suita, Japan
Yasuhisa Sano 1 Suita, Japan

Ai ISOHASHI 1 Suita-shi, Japan
Kazuto YAMAUCHI 1 Osaka, Japan
Kazuto Yamauchi 1 Suita-shi, Japan
Kazuto YAMAUCHI 1 Suita-shi, Osaka, Japan

Yasuhisa SANO 1 Suita-shi, Japan
Ai Isohashi 1 Suita, Japan

Recent patent applications by Toho Engineering Co., Ltd.

Toho Engineering Co., Ltd. based in Yokkaichi-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2019-04-25 ✅ Patent 10,665,480 granted on 2020-05-26

US20190122904A1

Electricity

Planarizing processing method and planarizing processing device

#2 | 2018-09-27 ✅ Patent 10,770,301 granted on 2020-09-08

US20180277380A1

Electricity

Planarization processing device

#3 | 2017-04-06 ✅ Patent 10,199,242 granted on 2019-02-05

US20170098559A1

Electricity

Planarizing processing method and planarizing processing device

#4 | 2017-03-09 ✅ Patent 10,163,645 granted on 2018-12-25

US20170069506A1

Electricity

Method for processing wide-bandgap semiconductor substrate and apparatus therefor

#5 | 2014-02-20 ✅ Patent 9,082,715 granted on 2015-07-14

US20140051249A1

Electricity

Substrate polishing apparatus

Also check out Toho Engineering Co., Ltd.'s (Yokkaichi-shi, Japan) applicant profile with 5 patent applications submitted.

AssigneeID:

55786 ⎘