Eisuke SUZUKI

City:

Yokkaichi-shi

Country:

Japan

Published Applications:

Last publication date:

2019-04-25

Top Assignees for applications by Eisuke SUZUKI

The entities that hold a legal rights for patent applications filed by inventor SUZUKI Eisuke:

Toho Engineering Co., Ltd. 4 Yokkaichi-shi, Japan
OSAKA UNIVERSITY 2 Suita-shi, Osaka, Japan
TOHO ENGINEERING KABUSHIKI KAISHA 1 Yokkaichi-shi, Japan
TOHO ENGINEERING KABUSHIKI KAISHA 1 Yokkaichi-shi, Mie, Japan

Recent patent applications by SUZUKI Eisuke

Eisuke SUZUKI from Yokkaichi-shi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2019-04-25

US20190122904A1

Electricity

Planarizing processing method and planarizing processing device

#2 | 2018-09-27

US20180277380A1

Electricity

Planarization processing device

#3 | 2017-04-06

US20170098559A1

Electricity

Planarizing processing method and planarizing processing device

#4 | 2014-02-20

US20140051249A1

Electricity

Substrate polishing apparatus

#5 | 2013-01-31

US20130029566A1

Performing operations; transporting

Polishing pad auxiliary plate and polishing device equipped with polishing pad auxiliary plate

InventorID:

67446 ⎘