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Assignee profile:

YMT CO., LTD.

City:

Incheon

Country:

South Korea

Published Applications:

Last publication date:

2024-07-11

Patent Grants:

Last grant date:

2025-09-02

Top Inventors for applications by YMT CO., LTD.

These are the the leading inventors for applications assigned to YMT CO., LTD.:

Sung-Wook CHUN 10 Incheon, South Korea
Bo Mook CHUNG 6 Incheon, South Korea
Dea Geun KIM 4 Incheon, South Korea
Nak Eun KO 4 Bucheon-si, South Korea

Ju Yong SIM 3 Seoul, South Korea
Myong Hwan PARK 2 Incheon, South Korea
Dong Gi An 1 Gyeongsangnam-do, South Korea
Dae Hoon Lee 1 Anyang-si, South Korea

Youn Bong Kang 1 Incheon, South Korea
Jung Il Kim 1 Incheon, South Korea
Dek Gin Yang 1 Chungcheongbuk-do, South Korea
Mi Jung Han 1 Gyeonggi-do, South Korea

Dae Hoon Lee 1 Asan-si, South Korea
Hyeong Gyu Park 1 Ansan-si, South Korea
Young-Kuk Kim 1 Seoul, South Korea
Seon Gi Jeon 1 Ansan-si, South Korea

Hyun Woo JEON 1 Incheon, South Korea
Chul-Min LEE 1 Chungcheongnam-do, South Korea
Myong Whan PARK 1 Incheon, South Korea
Kyu Hyok Yim 1 Chungcheongbuk-do, South Korea

Ik Beom Kim 1 Incheon, South Korea
Jun Mo Hong 1 Ansan-si, South Korea

Recent patent applications by YMT CO., LTD.

YMT CO., LTD. based in Incheon, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2024-07-11 ✅ Patent 12,408,279 granted on 2025-09-02

US20240237229A9

Electricity

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME

#2 | 2024-05-02 ✅ Patent 12,534,426 granted on 2026-01-27

US20240140905A1

Chemistry; metallurgy

LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE

#3 | 2024-04-25 ✅ Patent 12,522,559 granted on 2026-01-13

US20240132441A1

Chemistry; metallurgy

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

#4 | 2024-01-11 ✅ Patent 12,495,494 granted on 2025-12-09

US20240015885A1

Electricity

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME

#5 | 2023-01-19 ✅ Patent 12,139,811 granted on 2024-11-12

US20230020180A1

Chemistry; metallurgy

Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same

#6 | 2021-01-21 ✅ Patent 11,499,233 granted on 2022-11-15

US20210017650A1

Chemistry; metallurgy

Plated laminate and printed circuit board

#7 | 2018-10-04 ✅ Patent 11,028,495 granted on 2021-06-08

US20180282890A1

Chemistry; metallurgy

Method for producing porous copper foil and porous copper foil produced by the same

#8 | 2015-11-12 ✅ Patent 9,758,889 granted on 2017-09-12

US20150327364A1

Electricity

Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby

#9 | 2014-04-10

US20140098504A1

Electricity

ELECTROPLATING METHOD FOR PRINTED CIRCUIT BOARD

#10 | 2007-05-10

US20070104929A1

Electricity

Method for plating printed circuit board and printed circuit board manufactured therefrom

Also check out YMT CO., LTD.'s (Incheon, South Korea) applicant profile with 11 patent applications submitted.

AssigneeID:

60881 ⎘