Nak Eun KO

City:

Bucheon-si

Country:

South Korea

Published Applications:

Last publication date:

2024-07-11

Top Assignees for applications by Nak Eun KO

The entities that hold a legal rights for patent applications filed by inventor KO Nak Eun:

Nak Eun KO from Bucheon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME

LEVELING AGENT AND ELECTROPLATING COMPOSITION FOR FORMING CIRCUIT PATTERN INCLUDING THE SAME

LEVELER AND ELECTROPLATING COMPOSITION FOR FILLING VIA HOLE

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME

InventorID:

5964210 ⎘