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Assignee profile:

Yibu Semiconductor Co., Ltd.

City:

Shanghai

Country:

China

Published Applications:

30

Last publication date:

2026-01-01

Patent Grants:

16

Last grant date:

2025-07-15

Top Inventors for applications by Yibu Semiconductor Co., Ltd.

These are the the leading inventors for applications assigned to Yibu Semiconductor Co., Ltd.:

Weiping Li 16 Shanghai, China
Ming Li 5 Fremont, CA United States
Ming Li 5 Shanghai, China
Yifan Guo 2 Shanghai, China

Wenqi Li 2 Shanghai, China

Recent patent applications by Yibu Semiconductor Co., Ltd.

Yibu Semiconductor Co., Ltd. based in Shanghai, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-01-01

US20260005111A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

#2 | 2025-10-23

US20250329702A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#3 | 2025-10-23

US20250329700A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#4 | 2025-07-03

US20250219043A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#5 | 2025-07-03

US20250219018A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#6 | 2025-04-24

US20250132287A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#7 | 2025-04-24

US20250132286A1

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AND ELECTRONIC DEVICE

#8 | 2025-03-06

US20250079427A1

METHOD FOR FABRICATING FAN-OUT PACKAGE

#9 | 2025-02-13

US20250054821A1

COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSITE CARRIER IN SEMICONDUCTOR PACKAGING

#10 | 2024-11-21

US20240387500A1

MULTI-CHIP PACKAGE AND METHOD OF MAKING

#11 | 2024-10-31

US20240363489A1

CHIP STACK AND FABRICATION METHOD

#12 | 2024-08-08

US20240266320A1

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INTERCONNECTED SEMICONDUCTOR DEVICES

#13 | 2024-07-04

US20240222329A1

STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE

#14 | 2024-07-04

US20240222323A1

FAN-OUT STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE

#15 | 2024-05-09 ✅ Patent 12,362,327 granted on 2025-07-15

US20240153918A1

Method of Forming Packages of Stacked Chips

#16 | 2022-08-25 ✅ Patent 12,500,203 granted on 2025-12-16

US20220271002A1

Semiconductor Packaging Method, Semiconductor Assembly and Electronic Device Comprising Semiconductor Assembly

#17 | 2022-08-04 ✅ Patent 12,154,884 granted on 2024-11-26

US20220246576A1

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

#18 | 2022-06-30 ✅ Patent 12,431,465 granted on 2025-09-30

US20220208733A1

Chip Package and Method of Forming Chip Packages

#19 | 2022-06-30 ✅ Patent 12,218,090 granted on 2025-02-04

US20220208709A1

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

#20 | 2022-06-30 ✅ Patent 12,159,850 granted on 2024-12-03

US20220208708A1

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

#21 | 2022-06-30 ✅ Patent 12,125,776 granted on 2024-10-22

US20220208669A1

Method for forming semiconductor package and semiconductor package

#22 | 2022-06-09 ✅ Patent 12,224,267 granted on 2025-02-11

US20220181297A1

Chip interconnecting method, interconnect device and method for forming chip packages

#23 | 2022-06-09 ✅ Patent 12,293,986 granted on 2025-05-06

US20220181296A1

Method for forming chip packages and a chip package

#24 | 2022-06-09 ✅ Patent 12,087,734 granted on 2024-09-10

US20220181295A1

Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chip

#25 | 2022-06-02 ✅ Patent 12,087,737 granted on 2024-09-10

US20220173075A1

Method of forming chip package having stacked chips

#26 | 2022-06-02 ✅ Patent 12,406,964 granted on 2025-09-02

US20220173074A1

Chip Package and Method of Forming Chip Packages

#27 | 2022-06-02 ✅ Patent 11,973,061 granted on 2024-04-30

US20220173073A1

Chip package including stacked chips and chip couplers

#28 | 2022-06-02 ✅ Patent 12,368,124 granted on 2025-07-22

US20220173063A1

Method for Forming Semiconductor Package and Semiconductor Package

#29 | 2022-06-02 ✅ Patent 12,046,525 granted on 2024-07-23

US20220173005A1

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

#30 | 2022-06-02 ✅ Patent 11,955,396 granted on 2024-04-09

US20220173004A1

Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly

Also check out Yibu Semiconductor Co., Ltd.'s (Shanghai, China) applicant profile with 32 patent applications submitted.

AssigneeID:

612366 ⎘