Fremont, California
United States
48
2025-02-13
The entities that hold a legal rights for patent applications filed by inventor Li Ming:
Ming Li from Fremont, US has applied for patents for these inventions. The list has both pending applications and granted patents:
COMPOSITE CARRIER, METHOD OF MAKING AND METHOD OF USING THE COMPOSITE CARRIER IN SEMICONDUCTOR PACKAGING
#2 | 2024-12-05MULTI-DIE MEMORY DEVICE
#3 | 2024-11-21MULTI-CHIP PACKAGE AND METHOD OF MAKING
#4 | 2024-10-31CHIP STACK AND FABRICATION METHOD
#5 | 2024-08-01METHODS AND SYSTEMS FOR GENOMIC ANALYSIS
#6 | 2024-07-04STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE
#7 | 2024-07-04FAN-OUT STACKED PACKAGE, METHOD OF MAKING AND ELECTRONIC DEVICE INCLUDING THE STACKED PACKAGE
#8 | 2024-01-11C-shroud Modification For Plasma Uniformity Without Impacting Mechanical Strength Or Lifetime Of The C-shroud
#9 | 2023-12-28Packaged integrated device with memory buffer integrated circuit die and memory devices on module substrate
#10 | 2023-11-09Multi-die memory device
#11 | 2023-05-04PACKAGING TECHNIQUES FOR BACKSIDE MESH CONNECTIVITY
#12 | 2022-12-08METHODS AND SYSTEMS FOR GENOMIC ANALYSIS
#13 | 2022-09-01Methods and systems for genomic analysis
#14 | 2022-05-05Multi-die memory device
#15 | 2022-04-07Method and apparatus to improve connection pitch in die-to-wafer bonding
#16 | 2021-09-30Packaged integrated device having memory buffer integrated circuit asymmetrically positioned on substrate
#17 | 2021-08-26METHOD AND APPARATUS FOR PROCESSING WAFERS
#18 | 2021-06-24Methods and systems for genomic analysis
#19 | 2021-06-24Multi-die memory device
#20 | 2021-02-04Packaging techniques for backside mesh connectivity
#21 | 2020-10-15Integrated circuit shield
#22 | 2020-10-08Multi-die memory device
#23 | 2019-07-18Multi-die memory device
#24 | 2018-07-24Methods and systems for genomic analysis
#25 | 2018-06-14Multi-die memory device
#26 | 2016-08-04Multi-die memory device
#27 | 2016-03-29Memory capacity expansion using a memory riser
#28 | 2016-01-21Methods and systems for genomic analysis
#29 | 2015-11-19Multi-die memory device
#30 | 2015-03-05Methods and systems for genomic analysis
#31 | 2014-09-04Multi-die memory device
#32 | 2012-11-22Multi-die memory device
#33 | 2012-09-20Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element
#34 | 2012-07-26Packaged semiconductor device for high performance memory and logic
#35 | 2012-07-19DRAM device with built-in self-test circuitry
#36 | 2011-05-19DETACHABLE INTERCONNECT FOR CONFIGURABLE WIDTH MEMORY SYSTEM
#37 | 2010-12-23High-speed memory package
#38 | 2010-12-16System and method for dissipating heat from semiconductor devices
#39 | 2010-09-16Repairing defects in a nonvolatile semiconductor memory device utilizing a heating element
#40 | 2010-04-15Multi-die memory device
#41 | 2009-12-24System and method for dissipating heat from a semiconductor module
#42 | 2008-06-26Semiconductor Package With Rigid And Flexible Circuits
#43 | 2006-10-05Heat sink for multiple semiconductor modules
#44 | 2006-08-17Heat spreader clamping mechanism for semiconductor modules
#45 | 2006-08-17Semiconductor package with low and high-speed signal paths
#46 | 2006-01-12System and method for dissipating heat from a semiconductor module
#47 | 2005-08-04Method and apparatus for providing an integrated circuit cover
#48 | 2005-03-22Method and apparatus for providing an integrated circuit cover
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