Guangdong
China
37
2022-07-21
32
2025-02-25
These are the the leading inventors for applications assigned to Shengyi Technology Co., Ltd.:
Shengyi Technology Co., Ltd. based in Guangdong, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board
#2 | 2022-02-24 ✅ Patent 11,975,507 granted on 2024-05-07Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit board
#3 | 2021-12-30 ✅ Patent 11,970,591 granted on 2024-04-30Resin composition, prepreg for printed circuit and metal-coated laminate
#4 | 2021-09-30 ✅ Patent 11,930,595 granted on 2024-03-12Circuit material and circuit board containing the same
#5 | 2021-07-22 ✅ Patent 11,661,378 granted on 2023-05-30Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof
#6 | 2020-10-22 ✅ Patent 11,649,351 granted on 2023-05-16Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same
#7 | 2020-08-06 ✅ Patent 11,261,305 granted on 2022-03-01Thermosetting resin composition, prepreg, laminate, and printed circuit board
#8 | 2020-08-06 ✅ Patent 11,053,352 granted on 2021-07-06Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit board
#9 | 2020-07-02EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED-CIRCUIT BOARD COMPRISING SAME
#10 | 2020-07-02 ✅ Patent 11,319,397 granted on 2022-05-03Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
#11 | 2020-05-21 ✅ Patent 11,390,735 granted on 2022-07-19Thermosetting resin composition and prepreg and metal foil-covered laminate made using same
#12 | 2020-05-21THERMOSETTING RESIN COMPOSITION, AND PREPREG AND METAL FOIL CLAD LAMINATE PREPARED FROM SAME
#13 | 2020-03-19 ✅ Patent 10,723,875 granted on 2020-07-28Halogen-free epoxy resin composition and a prepreg and a laminate using the same
#14 | 2020-02-06 ✅ Patent 11,180,617 granted on 2021-11-23Method for preparing benzoxazine-containing resin composition, and prepreg and laminate made therefrom
#15 | 2019-01-03 ✅ Patent 10,465,069 granted on 2019-11-05Polyphenyl ether resin composition and prepreg, laminated board and printed circuit board containing same
#16 | 2018-08-02 ✅ Patent 10,645,806 granted on 2020-05-05Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate
#17 | 2018-08-02 ✅ Patent 10,745,599 granted on 2020-08-18Polyphenyl ether resin composition and use thereof in high-frequency circuit substrate
#18 | 2018-05-10HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARDS USING THE SAME
#19 | 2018-04-26 ✅ Patent 10,400,173 granted on 2019-09-03Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof
#20 | 2018-02-08 ✅ Patent 10,858,514 granted on 2020-12-08Resin composition and pre-preg and laminate using the composition
#21 | 2018-02-08 ✅ Patent 10,584,222 granted on 2020-03-10Resin composition and pre-preg and laminate using the composition
#22 | 2017-12-07 ✅ Patent 10,414,136 granted on 2019-09-17Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board
#23 | 2017-11-30 ✅ Patent 10,240,074 granted on 2019-03-26Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor
#24 | 2017-10-05 ✅ Patent 10,513,605 granted on 2019-12-24Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same
#25 | 2017-09-07 ✅ Patent 10,343,383 granted on 2019-07-09Thermosetting resin composition and prepreg and laminated board prepared therefrom
#26 | 2016-08-18 ✅ Patent 9,840,620 granted on 2017-12-12Halogen-free resin composition and uses thereof
#27 | 2016-08-11 ✅ Patent 10,208,188 granted on 2019-02-19Thermosetting resin composition and uses thereof
#28 | 2016-01-28 ✅ Patent 9,493,651 granted on 2016-11-15Halogen-free resin composition, and prepreg and laminate for printed circuits using the same
#29 | 2015-12-10 ✅ Patent 9,487,652 granted on 2016-11-08Halogen-free resin composition, and prepreg and laminate for printed circuits using same
#30 | 2015-10-29 ✅ Patent 9,745,464 granted on 2017-08-29Halogen-free flame retardant resin composition and the use thereof
#31 | 2015-08-27EPOXY RESIN COMPOUND AND PREPREG AND COPPER-CLAD LAMINATE MANUFACTURED USING THE COMPOUND
#32 | 2015-06-11 ✅ Patent 9,670,362 granted on 2017-06-06Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom
#33 | 2014-11-27Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the Same
#34 | 2014-10-30 ✅ Patent 9,744,745 granted on 2017-08-29Circuit substrate and manufacturing method thereof
#35 | 2014-07-24 ✅ Patent 9,062,011 granted on 2015-06-23Benzoxazine intermediate and preparation method thereof
#36 | 2014-06-05 ✅ Patent 9,139,750 granted on 2015-09-22Halogen-free resin composition and method for preparation of copper clad laminate with same
#37 | 2014-05-29 ✅ Patent 8,889,816 granted on 2014-11-18Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight
Also check out Shengyi Technology Co., Ltd.'s (Guangdong, China) applicant profile with 44 patent applications submitted.
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