HOWA SANGYO CO., LTD.

City:

Chiba

Country:

Japan

Published Applications:

Last publication date:

2026-06-18

Patent Grants:

Last grant date:

Top Inventors for applications by HOWA SANGYO CO., LTD.

These are the the leading inventors for applications assigned to HOWA SANGYO CO., LTD.:

Naoto Shirai 1 Chiba, Japan

Recent patent applications by HOWA SANGYO CO., LTD.

HOWA SANGYO CO., LTD. based in Chiba, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-06-18

US20260167405A1

Performing operations; transporting

PACKAGING BAG

AssigneeID:

728296 ⎘