STMICROELECTRONICS PTE LTD.

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

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WAFER LEVEL PACKAGING HAVING REDISTRIBUTION LAYER FORMED UTILIZING LASER DIRECT STRUCTURING

#3 | 2026-04-09

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LOW COST WAFER LEVEL PACKAGES AND SILICON

#4 | 2026-01-08

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CHARGE COUPLED FIELD EFFECT RECTIFIER DIODE AND METHOD OF MAKING

#5 | 2025-10-09

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PACKAGE WITH POLYMER PILLARS AND RAISED PORTIONS

#6 | 2025-10-02

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SENSOR DIE PACKAGE

#7 | 2025-09-18

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WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES

#8 | 2025-06-12

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STACKED DIE PACKAGE INCLUDING A MULTI-CONTACT INTERCONNECT

#9 | 2025-05-29

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LOW PROFILE SENSOR PACKAGES

#10 | 2025-05-29

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MEMS THIN MEMBRANE WITH STRESS STRUCTURE

#11 | 2025-03-06

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OPTICAL SENSOR PACKAGE AND METHOD OF MAKING AN OPTICAL SENSOR PACKAGE

#12 | 2024-12-05

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PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A MOISTURE AND PROTON BARRIER

#13 | 2024-11-14

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POWER MOSFET WITH REDUCED CURRENT LEAKAGE AND METHOD OF FABRICATING THE POWER MOSFET

#14 | 2024-08-22

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EMBEDDED WAFER LEVEL OPTICAL SENSOR PACKAGING

#15 | 2024-06-13 ✅ Patent 12,356,743 granted on 2025-07-08

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SLANTED GLASS EDGE FOR IMAGE SENSOR PACKAGE

#16 | 2024-05-02

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PANEL LEVEL SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#17 | 2024-04-18

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CHIP SIZE PACKAGE AND SYSTEM

#18 | 2024-02-01

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OPTICAL SENSOR PACKAGE WITH ENCAPSULANT IS BETWEEN AND SEPARATES SUBSTRATES AND MULTIPLE ASSEMBLIES

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Gas sensor device for detecting gases with large molecules

#20 | 2024-01-25

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POWER PACKAGE WITH COPPER PLATING AND MOLDING STRUCTURE

#21 | 2023-12-21 ✅ Patent 12,354,986 granted on 2025-07-08

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WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES

#22 | 2023-09-28 ✅ Patent 12,557,694 granted on 2026-02-17

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SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

#23 | 2023-08-24

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METHOD FOR AUTO-ALIGNED MANUFACTURING OF A TRENCH-GATE MOS TRANSISTOR, AND SHIELDED-GATE MOS TRANSISTOR

#24 | 2023-08-03 ✅ Patent 12,525,564 granted on 2026-01-13

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INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

#25 | 2023-07-27

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THICK BONDING PAD STRUCTURE FOR WIRE BOND STRESS REDUCTION

#26 | 2023-07-27

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SEMICONDUCTOR METAL OXIDE BASED GAS SENSOR ACTIVATED AT ZERO HEATER POWER

#27 | 2023-07-20

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SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS

#28 | 2023-06-22 ✅ Patent 12,136,608 granted on 2024-11-05

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Multi-chip package

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Semiconductor device with a dielectric between portions

#30 | 2023-05-04

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OXIDE FIELD TRENCH POWER MOSFET WITH A MULTI EPITAXIAL LAYER SUBSTRATE CONFIGURATION

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Molded proximity sensor

#32 | 2023-02-02 ✅ Patent 12,494,447 granted on 2025-12-09

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LOW COST WAFER LEVEL PACKAGES AND SILICON

#33 | 2023-02-02

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SENSOR PACKAGE WITH EMBEDDED INTEGRATED CIRCUIT

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SENSOR PACKAGE INCLUDING A SENSOR DIE

#35 | 2022-12-08 ✅ Patent 12,439,621 granted on 2025-10-07

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CHARGE COUPLED FIELD EFFECT RECTIFIER DIODE AND METHOD OF MAKING

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OPTICAL INTEGRATED CIRCUIT SENSOR PACKAGE USING A STACKED CONFIGURATION FOR THE SENSOR DIE AND THE EMITTER DIE

#37 | 2022-11-03 ✅ Patent 12,230,619 granted on 2025-02-18

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Low profile sensor packages

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Method of manufacturing electronic devices and corresponding electronic device

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Gate contact structure for a trench power MOSFET with a split gate configuration

#40 | 2022-10-06

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SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING

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Crack detection integrity check

#42 | 2022-09-08 ✅ Patent 12,519,046 granted on 2026-01-06

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WAFER LEVEL PACKAGING HAVING REDISTRIBUTION LAYER FORMED UTILIZING LASER DIRECT STRUCTURING

#43 | 2022-06-30 ✅ Patent 12,364,038 granted on 2025-07-15

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SENSOR DIE PACKAGE

#44 | 2022-06-23 ✅ Patent 12,266,636 granted on 2025-04-01

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Stacked die package including a multi-contact interconnect

#45 | 2022-06-16

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PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A MOISTURE AND PROTON BARRIER

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Optical sensor package and method of making an optical sensor package

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PACKAGE WITH POLYMER PILLARS AND RAISED PORTIONS

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Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit

#49 | 2022-04-21 ✅ Patent 11,908,831 granted on 2024-02-20

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Method for manufacturing a wafer level chip scale package (WLCSP)

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Proximity sensor with integrated ALS

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Split-gate trench power MOSFET with self-aligned poly-to-poly isolation

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Embedded wafer level optical sensor packaging

#53 | 2021-12-23 ✅ Patent 12,637,349 granted on 2026-05-26

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WAFER LEVEL CHIP SCALE PACKAGING WITH SENSOR

#54 | 2021-12-09 ✅ Patent 11,942,496 granted on 2024-03-26

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Slanted glass edge for image sensor package

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Molded range and proximity sensor with optical resin lens

#56 | 2021-12-02

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POWER MOSFET WITH REDUCED CURRENT LEAKAGE AND METHOD OF FABRICATING THE POWER MOSFET

#57 | 2021-10-28 ✅ Patent 11,502,192 granted on 2022-11-15

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Monolithic charge coupled field effect rectifier embedded in a charge coupled field effect transistor

#58 | 2021-10-21 ✅ Patent 11,996,397 granted on 2024-05-28

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Wafer level proximity sensor

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WLCSP with transparent substrate and method of manufacturing the same

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Adaptive test method and designs for low power mox sensor

#61 | 2021-07-15

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MEMS THIN MEMBRANE WITH STRESS STRUCTURE

#62 | 2021-07-01 ✅ Patent 11,581,280 granted on 2023-02-14

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WLCSP package with different solder volumes

#63 | 2021-06-24 ✅ Patent 11,211,254 granted on 2021-12-28

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Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical polishing of a coupled dielectric oxide layer

#64 | 2021-05-27 ✅ Patent 11,562,937 granted on 2023-01-24

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Semiconductor package with protected sidewall and method of forming the same

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Gas sensor device for detecting gases with large molecules

#66 | 2021-03-18 ✅ Patent 11,828,877 granted on 2023-11-28

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Optical sensor package with encapsulant is between and separates substrates and multiple assemblies

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Package with electrical interconnection bridge

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Multi-chip package

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Thin semiconductor chip using a dummy sidewall layer

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Wafer level chip scale package having varying thicknesses

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Semiconductor device with a dielectric between portions

#72 | 2020-11-19 ✅ Patent 11,404,355 granted on 2022-08-02

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Package with lead frame with improved lead design for discrete electrical components and manufacturing the same

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Molded range and proximity sensor with optical resin lens

#74 | 2020-07-30 ✅ Patent 11,366,156 granted on 2022-06-21

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Crack detection integrity check

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Semiconductor sensor package

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Electronic device comprising a support substrate and stacked electronic chips

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Method for removing a sacrificial layer on semiconductor wafers

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Gas sensors

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Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit

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Selective multi-gas detection through pulse heating in a gas sensor

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Molded proximity sensor

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Image sensing device with cap and related methods

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Proximity sensor with integrated ALS

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ELECTRONIC DEVICE COMPRISING ELECTRONIC CHIPS

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Optical sensor package including a cavity formed in an image sensor die

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Battery swap system for mobile stations

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Semiconductor package with protected sidewall and method of forming the same

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Human necessities

Flexible electrochemical micro-sensor

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Gas sensor device for detecting gases with large molecules

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Integrated multi-sensor module

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Integrated circuit (IC) package with a solder receiving area and associated methods

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Adaptive test method and designs for low power mox sensor

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Ambient light sensor with light protection

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Proximity sensor with integrated ALS

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Package with lead frame with improved lead design for discrete electrical components and manufacturing the same

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Semiconductor sensor package

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Integrated multi-sensor module

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Molded range and proximity sensor with optical resin lens

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Glue bleeding prevention cap for optical sensor packages

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