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Inventor profile of:

Roseanne Duca

City:

Ghaxaq

Country:

Malta

Published Applications:

Last publication date:

2025-04-03

Top Assignees for applications by Roseanne Duca

The entities that hold a legal rights for patent applications filed by inventor Duca Roseanne:

STMicroelectronics (Malta) Ltd 10 Kirkop, Malta
STMicroelectronics International N.V. 3 Geneva, Switzerland
STMICROELECTRONICS S.R.L. 3 Agrate Brianza, Italy
STMICROELECTRONICS PTE LTD. 3 Singapore, Singapore
STMICROELECTRONICS S.R.L. 2 Agrate Brianza (MB), Italy
STMICROELECTRONICS (GRENOBLE 2) SAS 2 Grenoble, France
STMicroelectronics (Mala) Ltd 1 Kirkop, Malta

Recent patent applications by Duca Roseanne

Roseanne Duca from Ghaxaq, MT has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2025-04-03

US20250112107A1

Electricity

HEAT SINK, SLUG, OR SPREADER AND METHOD OF MANUFACTURING THE SAME

#2 | 2024-07-11

US20240228264A9

Performing operations; transporting

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

#3 | 2024-04-25

US20240132340A1

Performing operations; transporting

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

#4 | 2024-02-01

US20240038610A1

Electricity

SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURING THE SAME

#5 | 2023-02-16

US20230046645A1

Electricity

INTEGRATED CIRCUIT PACKAGE WITH WARPAGE CONTROL USING CAVITY FORMED IN LAMINATED SUBSTRATE BELOW THE INTEGRATED CIRCUIT DIE

#6 | 2023-01-05

US20230005755A1

Electricity

Semiconductor device and corresponding method

#7 | 2021-06-03

US20210166949A1

Electricity

Semiconductor device and corresponding method

#8 | 2020-06-11

US20200185288A1

Electricity

Electronic device comprising a support substrate and an encapsulating cover for an electronic component

#9 | 2019-03-21

US20190088562A1

Electricity

Electronic device comprising a support substrate and an encapsulating cover for an electronic component

#10 | 2016-09-20

US14736353

Electricity

Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming

#11 | 2015-08-20

US20150235929A1

Electricity

Electronic device with heat dissipater

#12 | 2014-04-03

US20140091443A1

Electricity

Surface mount package for a semiconductor integrated device, related assembly and manufacturing process

InventorID:

709348 ⎘