SUMCO CORPORATION

FLAT EPITAXIAL WAFER HAVING MINIMAL THICKNESS VARIATION

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DOUBLE-SIDE POLISHING APPARATUS FOR WORKPIECE AND DOUBLE-SIDE POLISHING METHOD FOR WORKPIECE

#3 | 2026-04-16

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QUARTZ GLASS CRUCIBLE AND METHOD FOR PRODUCING SILICON SINGLE CRYSTAL USING SAME

#4 | 2026-04-09

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SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING PLANT, AND SEMICONDUCTOR MANUFACTURING METHOD

#5 | 2026-03-26

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SILICON WAFER WITH LASER MARK AND MANUFACTURING METHOD OF THE SAME

#6 | 2026-03-12

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METHOD FOR CONTROLING PULLING APPARATUS, CONTROL PROGRAM, CONTROL APPARATUS, METHOD FOR PRODUCING SINGLE CRYSTAL SILICON INGOT, AND SINGLE CRYSTAL SILICON INGOT

#7 | 2026-02-26

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METHOD FOR MODELING WAFER SHAPE, AND METHOD FOR MANUFACTURING WAFER

#8 | 2026-02-19

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METHOD FOR CLEANING SILICON WAFER, METHOD FOR PRODUCING SILICON WAFER, AND SILICON WAFER

#9 | 2026-02-12

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ONE-SIDE POLISHING APPARATUS FOR WORKPIECE, METHOD FOR ONE-SIDE POLISHING OF WORKPIECE, AND METHOD FOR MANUFACTURING SILICON WAFERS

#10 | 2026-02-05

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QUARTZ GLASS CRUCIBLE FOR SILICON SINGLE-CRYSTAL PULLING AND MANUFACTURING METHOD UTILIZING SAME

#11 | 2026-01-15

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METHOD FOR MANUFACTURING EPITAXIAL WAFER

#12 | 2026-01-01

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CYLINDRICAL GRINDING DEVICE, CYLINDRICAL GRINDING METHOD, AND WAFER MANUFACTURING METHOD

#13 | 2025-12-25

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PRODUCTION METHOD FOR SILICON MONOCRYSTAL

#14 | 2025-12-11

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METHOD OF EVALUATING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

#15 | 2025-12-11

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QUARTZ GLASS CRUCIBLE FOR SINGLE-CRYSTAL SILICON PULLING AND METHOD FOR PRODUCING SINGLE-CRYSTAL SILICON USING SAME

#16 | 2025-11-27

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SILICON WAFER AND MANUFACTURING METHOD THEREFOR

#17 | 2025-11-20

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METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER

#18 | 2025-11-20

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METHOD FOR DRESSING POLISHING PAD, METHOD FOR POLISHING SILICON WAFER, METHOD FOR PRODUCING SILICON WAFER, AND DEVICE FOR POLISHING SILICON WAFER

#19 | 2025-11-20

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MANAGEMENT DEVICE, MANAGEMENT METHOD, AND WAFER MANUFACTURING SYSTEM

#20 | 2025-10-30

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DETERMINATION METHOD OF WAFER POLISHING CONDITIONS, METHOD OF MANUFACTURING WAFER, AND WAFER ONE SIDE POLISHING SYSTEM

#21 | 2025-10-23

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METHOD OF EVALUATING SEMICONDUCTOR SAMPLE, EVALUATION DEVICE OF SEMICONDUCTOR SAMPLE AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

#22 | 2025-10-16

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DOPANT ADDITION METHOD, MONOCRYSTALLINE SILICON MANUFACTURING METHOD, DOPANT ADDITION CONTROL DEVICE, AND MONOCRYSTALLINE SILICON MANUFACTURING SYSTEM

#23 | 2025-10-16

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MATERIAL FEEDING METHOD, MONOCRYSTALLINE SILICON MANUFACTURING METHOD, MATERIAL FEED CONTROL DEVICE, AND MONOCRYSTALLINE SILICON MANUFACTURING SYSTEM

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SINGLE CRYSTAL PULLING APPARATUS

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METHOD FOR GROWING SINGLE-CRYSTAL SILICON, METHOD FOR PRODUCING SILICON WAFER, AND SINGLE-CRYSTAL PULLING DEVICE

#26 | 2025-09-18

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APPARATUS FOR MEASURING THICKNESS OF WORKPIECE, METHOD FOR MEASURING THICKNESS OF WORKPIECE, AND SYSTEM FOR POLISHING WORKPIECE

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SUBSTRATE TRANSPORT SYSTEM

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SUBSTRATE TRANSFER SYSTEM

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VAPOR DEPOSITION DEVICE

#30 | 2025-07-17

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METHOD AND APPARATUS FOR PRODUCING SILICON SINGLE CRYSTAL AND METHOD FOR PRODUCING SILICON WAFER

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MANUFACTURING METHOD OF SILICON SINGLE CRYSTAL

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SILICON WAFER AND EPITAXIAL SILICON WAFER

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EPITAXIAL SILICON WAFER AND METHOD FOR PRODUCING THE SAME

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N-TYPE SILICON SINGLE CRYSTAL PRODUCTION METHOD, N-TYPE SILICON SINGLE CRYSTAL INGOT, SILICON WAFER, AND EPITAXIAL SILICON WAFER

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PACKAGING UNIT AND TRANSPORTATION CONTAINER

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CUSHIONING MATERIAL, PACKING BODY, AND PACKING METHOD

#37 | 2025-02-13

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EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFER MANUFACTURING APPARATUS

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METHOD FOR CUTTING SILICON INGOT

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MANUFACTURING METHOD OF SINGLE CRYSTAL AND SINGLE CRYSTAL MANUFACTURING DEVICE

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MAGNET FOR SINGLE CRYSTAL PRODUCTION APPARATUS, SINGLE CRYSTAL PRODUCTION APPARATUS, AND METHOD OF PRODUCING SINGLE CRYSTAL

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PRODUCTION METHOD FOR SILICON MONOCRYSTAL AND PRODUCTION METHOD FOR SILICON WAFER

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METHOD OF MEASURING CONTACT ANGLE OF SILICON WAFER AND METHOD OF EVALUATING SURFACE CONDITION OF SILICON WAFER

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LOW RESISTIVITY WAFER

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METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSING DEVICE

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METHOD OF CLEANING SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

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METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSING DEVICE

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QUARTZ GLASS CRUCIBLE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SILICON SINGLE CRYSTAL

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POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

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DOUBLE-SIDE POLISHING METHOD FOR WORK AND DOUBLE-SIDE POLISHING APPARATUS FOR WORK

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DOUBLE-SIDE POLISHING APPARATUS AND DOUBLE-SIDE POLISHING METHOD FOR WORKPIECES

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SEMICONDUCTOR WAFER CLEANING DEVICE, SEMICONDUCTOR WAFER CLEANING METHOD, AND METHOD FOR MANUFACTURING SILICON WAFER

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WAFER VISUAL INSPECTION APPARATUS AND WAFER VISUAL INSPECTION METHOD

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QUARTZ GLASS CRUCIBLE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF SILICON SINGLE CRYSTAL

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METHOD OF CREATING CORRELATION RELATIONAL FORMULA FOR DETERMINING POLISHING CONDITION, METHOD OF DETERMINING POLISHING CONDITION, AND SEMICONDUCTOR WAFER MANUFACTURING METHOD

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METHOD OF EVALUATING SILICON SINGLE-CRYSTAL INGOT, METHOD OF EVALUATING SILICON EPITAXIAL WAFER, METHOD OF MANUFACTURING SILICON EPITAXIAL WAFER, AND METHOD OF EVALUATING SILICON MIRROR POLISHED WAFER

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WAFER SEPARATION APPARATUS AND METHOD, AND METHOD FOR MANUFACTURING SILICON WAFER

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POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR WAFER

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INFRARED TRANSMISSIVITY MEASUREMENT METHOD OF QUARTZ GLASS CRUCIBLE

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WAFER STORAGE CONTAINER CLEANING APPARATUS, AND WAFER STORAGE CONTAINER CLEANING METHOD

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PROCESSING CONDITION SETTING APPARATUS, PROCESSING CONDITION SETTING METHOD, AND WAFER PRODUCTION SYSTEM

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METHOD FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR SUBSTRATE

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METHOD OF MANUFACTURING MONOCRYSTALLINE SILICON

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HEATING PART OF SILICON SINGLE CRYSTAL MANUFACTURING DEVICE, CONVECTION PATTERN CONTROL METHOD FOR SILICON MELT, SILICON SINGLE CRYSTAL MANUFACTURING METHOD, SILICON WAFER MANUFACTURING METHOD, SILICON SINGLE CRYSTAL MANUFACTURING DEVICE, AND CONVECTION PATTERN CONTROL SYSTEM FOR SILICON MELT

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WAFER POLISHING METHOD AND WAFER PRODUCING METHOD

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METHOD OF POLISHING CARRIER PLATE, CARRIER PLATE, AND METHOD OF POLISHING SEMICONDUCTOR WAFER

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Method for producing silicon single crystal

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METHOD OF POLISHING SILICON WAFER AND METHOD OF PRODUCING SILICON WAFER

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METHOD OF ESTIMATING OXYGEN CONCENTRATION IN SILICON SINGLE CRYSTAL, METHOD OF MANUFACTURING SILICON SINGLE CRYSTAL, AND SILICON SINGLE CRYSTAL MANUFACTURING APPARATAUS

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QUARTZ GLASS CRUCIBLE, MANUFACTURING METHOD THEREFOR, AND METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL

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METHOD FOR GROWING SILICON SINGLE CRYSTAL

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SILICON SINGLE CRYSTAL GROWING METHOD

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DIFFERENTIAL PRESSURE MEASURING DEVICE AND DIFFERENTIAL PRESSURE MEASUREMENT METHOD

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SINGLE CRYSTAL MANUFACTURING METHOD, MAGNETIC FIELD GENERATOR, AND SINGLE CRYSTAL MANUFACTURING APPARATUS

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METHOD FOR PRODUCING SUPPORT SUBSTRATE FOR BONDED WAFER, AND SUPPORT SUBSTRATE FOR BONDED WAFER

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CARRIER MEASUREMENT DEVICE, CARRIER MEASUREMENT METHOD, AND CARRIER MANAGEMENT METHOD

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Method of cleaning pipe of single-wafer processing wafer cleaning apparatus

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SILICON WAFER AND EPITAXIAL SILICON WAFER

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MANUFACTURING METHOD OF SINGLE CRYSTALS

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PRODUCTION METHOD FOR SILICON MONOCRYSTAL

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WAFER POLISHING METHOD AND WAFER POLISHING DEVICE

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FLAT EPITAXIAL WAFER HAVING MINIMAL THICKNESS VARIATION

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EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

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Silicon wafer and manufacturing method of the same

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N-type silicon single crystal production method, n-type silicon single crystal ingot, silicon wafer, and epitaxial silicon wafer

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METHOD OF CLEANING WORK AND CLEANING SYSTEM FOR WORK

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Low resistivity wafer

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SUPPORT SUBSTRATE FOR BONDED WAFER

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METHOD AND APPARATUS FOR MANUFACTURING DEFECT-FREE MONOCRYSTALLINE SILICON CRYSTAL

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SINGLE CRYSTAL PRODUCTION APPARATUS AND SINGLE CRYSTAL PRODUCTION METHOD

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Semiconductor epitaxial wafer and method of producing semiconductor epitaxial wafer, and method of producing solid-state imaging device

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Method of heat-treating silicon wafer using lateral heat treatment furnace

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DEVICE FOR POLISHING OUTER PERIPHERY OF WAFER

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Method of double-side polishing work, method of producing work, and double-side polishing apparatus for a work

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Method of evaluating semiconductor wafer

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SILICON WAFER AND EPITAXIAL SILICON WAFER

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SILICON WAFER AND EPITAXIAL SILICON WAFER

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APPARATUS FOR DOUBLE-SIDE POLISHING WORK

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Quartz glass crucible with crystallization-accelerator-containing layer having gradient concentration

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Susceptor, epitaxial growth apparatus, method of producing epitaxial silicon wafer, and epitaxial silicon wafer

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