Calamba
Philippines
79
2024-05-30
78
2025-03-18
These are the the leading inventors for applications assigned to STMicroelectronics, Inc.:
STMicroelectronics, Inc. based in Calamba, PH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method for manufacturing leadless semiconductor package with wettable flanks
#2 | 2024-05-16 ✅ Patent 12,224,251 granted on 2025-02-11Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads
#3 | 2024-04-18 ✅ Patent 12,421,108 granted on 2025-09-23CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM (MEMS)
#4 | 2023-08-10 ✅ Patent 12,170,240 granted on 2024-12-17Lead frame for improving adhesive fillets on semiconductor die corners
#5 | 2023-06-15 ✅ Patent 12,080,657 granted on 2024-09-03Die embedded in substrate with stress buffer
#6 | 2023-03-02 ✅ Patent 12,494,442 granted on 2025-12-09LEADFRAME WITH VARYING THICKNESSES AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
#7 | 2022-09-15 ✅ Patent 12,211,772 granted on 2025-01-28Method of manufacturing semiconductor devices and corresponding semiconductor device
#8 | 2022-09-08 ✅ Patent 12,543,575 granted on 2026-02-03BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#9 | 2022-03-31 ✅ Patent 12,094,725 granted on 2024-09-17Leadframe package with pre-applied filler material
#10 | 2022-03-17 ✅ Patent 11,948,868 granted on 2024-04-02Compact leadframe package
#11 | 2022-02-10 ✅ Patent 11,848,256 granted on 2023-12-19Semiconductor package having die pad with cooling fins
#12 | 2022-01-06 ✅ Patent 11,916,090 granted on 2024-02-27Tapeless leadframe package with exposed integrated circuit die
#13 | 2022-01-06 ✅ Patent 11,688,715 granted on 2023-06-27Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
#14 | 2021-11-04 ✅ Patent 11,610,851 granted on 2023-03-21Die embedded in substrate with stress buffer
#15 | 2021-10-07 ✅ Patent 11,929,259 granted on 2024-03-12Method for manufacturing leadless semiconductor package with wettable flanks
#16 | 2021-08-26 ✅ Patent 11,664,239 granted on 2023-05-30Lead frame for improving adhesive fillets on semiconductor die corners
#17 | 2021-08-19 ✅ Patent 11,699,667 granted on 2023-07-11Leadframe with pad anchoring members and method of forming the same
#18 | 2021-08-05 ✅ Patent 11,715,677 granted on 2023-08-01Semiconductor device with frame having arms
#19 | 2021-06-17 ✅ Patent 11,552,007 granted on 2023-01-10Modified leadframe design with adhesive overflow recesses
#20 | 2021-06-17 ✅ Patent 11,897,763 granted on 2024-02-13Capless semiconductor package with a micro-electromechanical system (MEMS)
#21 | 2021-05-20 ✅ Patent 12,159,820 granted on 2024-12-03Flat no-lead package with surface mounted structure
#22 | 2021-04-22 ✅ Patent 11,557,548 granted on 2023-01-17Package with interlocking leads and manufacturing the same
#23 | 2021-04-15 ✅ Patent 12,074,100 granted on 2024-08-27Flat no-lead package with surface mounted structure
#24 | 2021-02-25 ✅ Patent 11,393,774 granted on 2022-07-19Semiconductor device having cavities at an interface of an encapsulant and a die pad or leads
#25 | 2021-02-18 ✅ Patent 11,658,098 granted on 2023-05-23Leadframe package with side solder ball contact and method of manufacturing
#26 | 2021-02-04 ✅ Patent 11,542,152 granted on 2023-01-03Semiconductor package with flexible interconnect
#27 | 2020-12-31 ✅ Patent 11,133,241 granted on 2021-09-28Semiconductor package with a cavity in a die pad for reducing voids in the solder
#28 | 2020-11-19 ✅ Patent 11,404,355 granted on 2022-08-02Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#29 | 2020-10-29 ✅ Patent 12,211,774 granted on 2025-01-28Lead stabilization in semiconductor packages
#30 | 2020-06-18 ✅ Patent 10,957,634 granted on 2021-03-23Modified leadframe design with adhesive overflow recesses
#31 | 2020-06-18 ✅ Patent 11,227,817 granted on 2022-01-18Compact leadframe package
#32 | 2020-06-18 ✅ Patent 11,348,863 granted on 2022-05-31Semiconductor package having a semiconductor die on a plated conductive layer
#33 | 2020-04-30 ✅ Patent 11,152,326 granted on 2021-10-19Semiconductor die with multiple contact pads electrically coupled to a lead of a lead frame
#34 | 2020-04-30 ✅ Patent 11,398,417 granted on 2022-07-26Semiconductor package having die pad with cooling fins
#35 | 2020-04-30 ✅ Patent 10,910,295 granted on 2021-02-02QFN pre-molded leadframe having a solder wettable sidewall on each lead
#36 | 2020-04-16 ✅ Patent 10,903,172 granted on 2021-01-26Package with interlocking leads and manufacturing the same
#37 | 2020-01-30 ✅ Patent 11,088,087 granted on 2021-08-10Micro module with a support structure
#38 | 2020-01-16 ✅ Patent 11,355,423 granted on 2022-06-07Bottom package exposed die MEMS pressure sensor integrated circuit package design
#39 | 2019-10-24 ✅ Patent 10,672,689 granted on 2020-06-02Protection from ESD during the manufacturing process of semiconductor chips
#40 | 2019-08-29 ✅ Patent 11,069,601 granted on 2021-07-20Leadless semiconductor package with wettable flanks
#41 | 2019-08-29 ✅ Patent 11,037,864 granted on 2021-06-15Lead frame for improving adhesive fillets on semiconductor die corners
#42 | 2019-06-27 ✅ Patent 11,031,350 granted on 2021-06-08Leadframe with pad anchoring members and method of forming the same
#43 | 2019-05-16 ✅ Patent 10,796,984 granted on 2020-10-06Leadframe having a conductive layer protruding through a lead recess
#44 | 2019-05-09 ✅ Patent 10,892,212 granted on 2021-01-12Flat no-lead package with surface mounted structure
#45 | 2019-03-28 ✅ Patent 10,872,849 granted on 2020-12-22Tapeless leadframe package with underside resin and solder contact
#46 | 2019-03-28 ✅ Patent 10,763,194 granted on 2020-09-01Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
#47 | 2019-03-07 ✅ Patent 10,840,168 granted on 2020-11-17Leadframe package with side solder ball contact and method of manufacturing
#48 | 2019-02-28 ✅ Patent 10,529,672 granted on 2020-01-07Package with interlocking leads and manufacturing the same
#49 | 2019-02-07 ✅ Patent 10,615,104 granted on 2020-04-07Modified leadframe design with adhesive overflow recesses
#50 | 2019-01-31 ✅ Patent 10,204,814 granted on 2019-02-12Semiconductor package with individually molded leadframe and die coupled at solder balls
#51 | 2019-01-17 ✅ Patent 10,461,019 granted on 2019-10-29Package with backside protective layer during molding to prevent mold flashing failure
#52 | 2019-01-03 ✅ Patent 10,388,594 granted on 2019-08-20Protection from ESD during the manufacturing process of semiconductor chips
#53 | 2018-12-13 ✅ Patent 10,541,196 granted on 2020-01-21QFN pre-molded leadframe having a solder wettable sidewall on each lead
#54 | 2018-11-15 ✅ Patent 10,128,169 granted on 2018-11-13Package with backside protective layer during molding to prevent mold flashing failure
#55 | 2018-10-04 ✅ Patent 10,141,246 granted on 2018-11-27Leadframe package with side solder ball contact and method of manufacturing
#56 | 2018-09-18 ✅ Patent 10,079,198 granted on 2018-09-18QFN pre-molded leadframe having a solder wettable sidewall on each lead
#57 | 2018-07-19 ✅ Patent 10,535,588 granted on 2020-01-14Die with metallized sidewall and method of manufacturing
#58 | 2018-07-05 ✅ Patent 10,109,563 granted on 2018-10-23Modified leadframe design with adhesive overflow recesses
#59 | 2018-05-24 ✅ Patent 11,270,894 granted on 2022-03-08Manufacturing method for semiconductor package with cantilever pads
#60 | 2018-05-15 ✅ Patent 9,972,558 granted on 2018-05-15Leadframe package with side solder ball contact and method of manufacturing
#61 | 2018-05-10 ✅ Patent 10,943,885 granted on 2021-03-09Method for making semiconductor device with sidewall recess and related devices
#62 | 2018-04-24 ✅ Patent 9,953,933 granted on 2018-04-24Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
#63 | 2018-04-05 ✅ Patent 10,147,673 granted on 2018-12-04Tapeless leadframe package with underside resin and solder contact
#64 | 2018-03-08 ✅ Patent 10,347,569 granted on 2019-07-09Leadframe package with stable extended leads
#65 | 2018-01-18 ✅ Patent 10,483,191 granted on 2019-11-19Bottom package exposed die MEMS pressure sensor integrated circuit package design
#66 | 2017-12-14 ✅ Patent 9,842,828 granted on 2017-12-12Stacked semiconductor package with compliant corners on folded substrate
#67 | 2017-05-18 ✅ Patent 9,842,794 granted on 2017-12-12Semiconductor package with integrated heatsink
#68 | 2017-04-20 ✅ Patent 11,227,776 granted on 2022-01-18Leadframe package with pre-applied filler material
#69 | 2017-01-05 ✅ Patent 9,847,281 granted on 2017-12-19Leadframe package with stable extended leads
#70 | 2016-12-29 ✅ Patent 9,536,756 granted on 2017-01-03Semiconductor packages separated using a sacrificial material
#71 | 2016-10-06 ✅ Patent 9,627,224 granted on 2017-04-18Semiconductor device with sloped sidewall and related methods
#72 | 2016-06-30 ✅ Patent 9,768,126 granted on 2017-09-19Stacked semiconductor packages with cantilever pads
#73 | 2016-06-30 ✅ Patent 9,899,236 granted on 2018-02-20Semiconductor package with cantilever pads
#74 | 2016-06-23 ✅ Patent 9,578,744 granted on 2017-02-21Leadframe package with pre-applied filler material
#75 | 2016-05-26 ✅ Patent 9,841,341 granted on 2017-12-12Package for semiconductor devices sensitive to mechanical and thermo-mechanical stresses, such as MEMS pressure sensors
#76 | 2015-12-03 ✅ Patent 9,258,890 granted on 2016-02-09Support structure for stacked integrated circuit dies
#77 | 2015-06-25PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS
#78 | 2014-12-25 ✅ Patent 9,117,810 granted on 2015-08-25Leadless semiconductor package and method of manufacture
#79 | 2012-07-05 ✅ Patent 8,426,254 granted on 2013-04-23Leadless semiconductor package with routable leads, and method of manufacture
Also check out STMicroelectronics, Inc.'s (Calamba, Philippines) applicant profile with 74 patent applications submitted.
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