Calamba
Philippines
21
2025-11-06
The entities that hold a legal rights for patent applications filed by inventor CADAG Aaron:
Aaron CADAG from Calamba, PH has applied for patents for these inventions. The list has both pending applications and granted patents:
BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#2 | 2024-05-30Method for manufacturing leadless semiconductor package with wettable flanks
#3 | 2022-09-08BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#4 | 2022-01-06Tapeless leadframe package with exposed integrated circuit die
#5 | 2021-12-16SEMICONDUCTOR DEVICE PACKAGES HAVING CAP WITH INTEGRATED ELECTRICAL LEADS
#6 | 2021-10-07Method for manufacturing leadless semiconductor package with wettable flanks
#7 | 2021-04-22Package with interlocking leads and manufacturing the same
#8 | 2020-10-29Lead stabilization in semiconductor packages
#9 | 2020-04-30QFN pre-molded leadframe having a solder wettable sidewall on each lead
#10 | 2020-04-16Package with interlocking leads and manufacturing the same
#11 | 2020-01-16Bottom package exposed die MEMS pressure sensor integrated circuit package design
#12 | 2019-08-29Leadless semiconductor package with wettable flanks
#13 | 2019-02-28Package with interlocking leads and manufacturing the same
#14 | 2019-01-17Package with backside protective layer during molding to prevent mold flashing failure
#15 | 2018-12-13QFN pre-molded leadframe having a solder wettable sidewall on each lead
#16 | 2018-11-15Package with backside protective layer during molding to prevent mold flashing failure
#17 | 2018-09-18QFN pre-molded leadframe having a solder wettable sidewall on each lead
#18 | 2018-04-24Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
#19 | 2018-01-18Bottom package exposed die MEMS pressure sensor integrated circuit package design
#20 | 2015-06-25PACKAGED IC DEVICES AND ASSOCIATED IC DEVICE PACKAGING METHODS
#21 | 2013-07-04Compensating mold plunger for integrated circuit manufacture
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