ClassID:

37488

B08B7/0021 - page 2 - CPC Classification

Classification description:

Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids

Recent Application in this class:
#301
20050268942
2005-12-08

Method for removing ceramic coatings from component surfaces

#302
20050268938
2005-12-08

Method and system for supplying carbon dioxide to a semiconductor tool having variable flow requirement

#303
20050261150
2005-11-24

Reactive fluid systems for removing deposition materials and methods for using same

#304
20050260107
2005-11-24

Method, process, chemistry and apparatus for treating a substrate

#305
20050257809
2005-11-24

Method and apparatus for removing substances from solid matrix with energy saving

#306
20050241672
2005-11-03

Extraction of impurities in a semiconductor process with a supercritical fluid

#307
20050224748
2005-10-13

Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition

#308
20050211269
2005-09-29

Method for the rapid thermal control of a work piece in liquid or supercritical fluid

#309
20050199263
2005-09-15

Cleaning method and cleaning apparatus

#310
20050192193
2005-09-01

Enhancement of silicon-containing particulate material removal using supercritical fluid-based compositions

#311
20050191861
2005-09-01

Using supercritical fluids and/or dense fluids in semiconductor applications

#312
20050189001
2005-09-01

Method for cleaning substrates using supercritical fluids

#313
20050183743
2005-08-25

Method and system for maintaining a solution of a sparingly soluble additive in a process fluid

#314
20050183740
2005-08-25

Process and apparatus for removing residues from semiconductor substrates

#315
20050160552
2005-07-28

Cleaning apparatus

#316
20050158472
2005-07-21

Methods of treating polymeric subtrates

#317
20050145271
2005-07-07

Megasonic cleaning vessel using supercritical CO2

#318
20050145263
2005-07-07

Substrate processing apparatus for processing substrates using dense phase gas and sonic waves

#319
20050124516
2005-06-09

Composition and method for removing photoresist materials from electronic components

#320
20050118832
2005-06-02

Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations

#321
20050118813
2005-06-02

Removal of MEMS sacrificial layers using supercritical fluid/chemical formulations

#322
20050107274
2005-05-19

Removal of post etch residues and copper contamination from low-k dielectrics using supercritical CO2 with diketone additives

#323
20050076935
2005-04-14

Method of cleaning semiconductor surfaces

#324
20050067002
2005-03-31

Processing chamber including a circulation loop integrally formed in a chamber housing

#325
20050051194
2005-03-10

Method for high-pressure processing

#326
20050039775
2005-02-24

Process and system for cleaning surfaces of semiconductor wafers

#327
20050028927
2005-02-10

Supercritical fluid technology for cleaning processing chambers and systems

#328
20050022850
2005-02-03

Regulation of flow of processing chemistry only into a processing chamber

#329
20050006310
2005-01-13

Purification and recovery of fluids in processing applications

#330
20050005957
2005-01-13

Cleaning apparatus for cleaning objects to be treated with use of cleaning composition

#331
20050000244
2005-01-06

System for use of land fills and recyclable materials

#332
17111476
2022-02-01

Method of processing semiconductor device

#333
16101362
2019-01-01

Composition for cleaning disarticulated skeletons