B23K1/0016 - CPC Classification

Classification description:

Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work Brazing of electronic components

Recent Application in this class:
#1
20240365475
2024-10-31

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

#2
20240363580
2024-10-31

BONDING SYSTEMS, AND METHODS OF PROVIDING A REDUCING GAS ON A BONDING SYSTEM

#3
20240363571
2024-10-31

Lead-Free Solder Ball

#4
20240359246
2024-10-31

CONTROL OF A PREHEATING PROCESS IN A SOLDERING MACHINE

#5
20240343055
2024-10-17

SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD

#6
20240341735
2024-10-17

METHOD FOR MANUFACTURING A BIOLOGICAL FLUID SENSOR

#7
20240341040
2024-10-10

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME

#8
20240335896
2024-10-10

Multifunctional sintering or diffusion soldering device and pressing tool

#9
20240293884
2024-09-05

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

#10
20240292514
2024-08-29

Printed Circuit Board And Method For Soldering A Chip Housing In A Process-Reliable Manner

#11
20240269759
2024-08-15

CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMBLY SOLDERING METHOD

#12
20240268036
2024-08-08

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

#13
20240261882
2024-08-08

METHOD OF ASSEMBLING SUBSTRATE SUPPORTING APPARATUS

#14
20240258060
2024-08-01

AGAVE SYRUP FORMULATION OR SUSPENSION FOR ACTIVE PHARMACEUTICAL AGENTS

#15
20240250336
2024-07-25

COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLING STRUCTURE

#16
20240238913
2024-07-18

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device

#17
20240237227
2024-07-11

PRODUCTION METHOD FOR CIRCUIT BOARD ASSEMBLY

#18
20240222318
2024-07-04

METHOD OF MAKING SEMICONDUCTOR DEVICE HAVING REDUCED BUMP HEIGHT VARIATION

#19
20240222302
2024-07-04

REPAIR OF SOLDER BUMPS

#20
20240213206
2024-06-27

Layered bonding material, semiconductor package, and power module

#21
20240196545
2024-06-13

ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PRECOAT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

#22
20240186764
2024-06-06

SPACER FOR ATTACHING COEFFICIENT OF THERMAL EXPANSION MISMATCHED COMPONENTS

#23
20240181548
2024-06-06

METHOD OF MANUFACTURING POWER MODULE

#24
20240177912
2024-05-30

MAGNETIC COMPONENT AND METHOD OF FORMING

#25
20240165868
2024-05-23

MULTI-MATERIAL FIBERS AND METHODS OF MANUFACTURING THE SAME

#26
20240157457
2024-05-16

PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT

#27
20240113067
2024-04-04

SOLDER REFLOW APPARATUS

#28
20240109157
2024-04-04

SOLDER JOINT

#29
20240106087
2024-03-28

JOINING METHODS AND DEVICES MADE USING SAID METHODS

#30
20240087915
2024-03-14

SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION

#31
20240087879
2024-03-14

INTEGRATE RINSE MODULE IN HYBRID BONDING PLATFORM

#32
20240075559
2024-03-07

SOLDER MATERIAL

#33
20240074065
2024-02-29

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

#34
20240071650
2024-02-29

PANE WITH ELECTRIC CONNECTION ELEMENT

#35
20240063171
2024-02-22

ASSEMBLY OF A CHIP TO A SUBSTRATE

#36
20240055707
2024-02-15

METHOD OF FORMING A BRAZED JOINT HAVING MOLYBDENUM MATERIAL

#37
20240052688
2024-02-15

CONNECTING ELEMENT FOR INSULATED GLAZING WITH AN ELECTRICALLY CONDUCTIVE COATING AND/OR ELECTRICALLY CONTROLLABLE FUNCTIONAL ELEMENT

#38
20240051051
2024-02-15

ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

#39
20240047837
2024-02-08

METHOD FOR JOINING CURRENT COLLECTOR, COLLECTOR JOINING STRUCTURE, AND BATTERY

#40
20240047411
2024-02-08

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

#41
20240047410
2024-02-08

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

#42
20240014167
2024-01-11

SUBSTRATE HOLDER AND BONDING SYSTEM

#43
20230422403
2023-12-28

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

#44
20230420317
2023-12-28

ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS

#45
20230413450
2023-12-21

ASSEMBLING METHOD OF ELECTRONIC MODULE

#46
20230405701
2023-12-21

NETWORK FOR CONTROLLING SOLDERING SYSTEMS AND METHOD THEREFOR

#47
20230390845
2023-12-07

Method For Manufacturing Ceramic Circuit Board

#48
20230387557
2023-11-30

BATTERY AND BATTERY PRODUCTION METHOD

#49
20230386862
2023-11-30

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

#50
20230373023
2023-11-23

CONTROLLED LOCAL HEATING OF SUBSTRATES

#51
20230371185
2023-11-16

Surface mount technology method and magnetic carrier system

#52
20230361233
2023-11-09

Equipment and method for producing solar cell string

#53
20230356314
2023-11-09

Soldering apparatus

#54
20230347453
2023-11-02

LOW MELTING-POINT BONDING MEMBER, METHOD FOR PRODUCING SAME, SEMICONDUCTOR ELECTRONIC CIRCUIT, AND METHOD FOR MOUNTING SAID SEMICONDUCTOR ELECTRONIC CIRCUIT

#55
20230347436
2023-11-02

MULTI-LAYER CERAMIC PLATE DEVICE

#56
20230339034
2023-10-26

VEHICULAR WINDOW ASSEMBLY PROCESS WITH TEMPERATURE CONTROL OF THE SOLDER JOINT THAT ATTACHES AN ELECTRICAL CONNECTOR

#57
20230330788
2023-10-19

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

#58
20230326903
2023-10-12

Bonding systems, and methods of providing a reducing gas on a bonding system

#59
20230314234
2023-10-05

INSPECTION METHOD

#60
20230311451
2023-10-05

JOINED BODY, HOLDING DEVICE, AND ELECTROSTATIC CHUCK

#61
20230303433
2023-09-28

METHOD OF ATTACHING A CONNECTOR TO A GLAZING

#62
20230282400
2023-09-07

MAGNET STRUCTURES COMPRISING A HIGH TEMPERATURE SUPERCONDUCTOR (HTS) CABLE IN GROOVE

#63
20230278127
2023-09-07

WELDING CONNECTION ELEMENT

#64
20230278123
2023-09-07

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

#65
20230268313
2023-08-24

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

#66
20230268312
2023-08-24

SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD

#67
20230253748
2023-08-10

Method for Securing the Electrical Contacts in a Connector System

#68
20230249272
2023-08-10

Thermal Treatment for Preconditioning or Restoration of a Solder Joint

#69
20230247772
2023-08-03

COATING DEVICE AND COMPONENT MOUNTING MACHINE

#70
20230241725
2023-08-03

SOLDER PASTES AND METHODS OF USING THE SAME

#71
20230201942
2023-06-29

BONDING APPARATUS AND BONDING METHOD FOR POWER TERMINAL OF HEATING PLATE

#72
20230199949
2023-06-22

Solder composition for use in solder joints of printed circuit boards

#73
20230198223
2023-06-22

Semiconductor device and method of manufacturing the semiconductor device

#74
20230197674
2023-06-22

Diffusion soldering with contaminant protection

#75
20230191518
2023-06-22

Soldering or sintering system with plurality of modules and temperature control

#76
20230187899
2023-06-15

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE

#77
20230178510
2023-06-08

WIRE BONDING APPARATUS

#78
20230147071
2023-05-11

Soldering apparatus

#79
20230146579
2023-05-11

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

#80
20230144136
2023-05-11

Barrier for preventing SMD components from drifting

#81
20230143981
2023-05-11

Transport system for transporting soldering material through a soldering apparatus, and a soldering apparatus

#82
20230143773
2023-05-11

Soldering apparatus

#83
20230142133
2023-05-11

SOLDERING APPARATUS

#84
20230114631
2023-04-13

CAPACITOR, CAPACITOR MANUFACTURING METHOD, AND CAPACITOR MOUNTING METHOD

#85
20230103964
2023-04-06

WELDING CONNECTION ELEMENT

#86
20230103069
2023-03-30

LED lamp and its power source module

#87
20230097863
2023-03-30

Method and system for stacking printed circuit board

#88
20230088097
2023-03-23

DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM

#89
20230086271
2023-03-23

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS

#90
20230081740
2023-03-16

High-temperature superconducting striated tape combinations

#91
20230080016
2023-03-16

Bonded body, ceramic copper circuit substrate, and semiconductor device

#92
20230067088
2023-03-02

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

#93
20230064063
2023-03-02

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

#94
20230061076
2023-03-02

Soldering of end chip components in series

#95
20230060603
2023-03-02

Method of using processing oven

#96
20230059451
2023-02-23

BRAZING STRUCTURE, BRAZING METHOD, AND X-RAY TUBE

#97
20230053414
2023-02-23

LED TUBE LAMP

#98
20230046823
2023-02-16

Automatic soldering processing system and automatic soldering processing method

#99
20230045808
2023-02-16

SYSTEMS, DEVICES, AND METHODS FOR TESTING INTEGRATED CIRCUITS IN THEIR NATIVE ENVIRONMENTS

#100
20230042727
2023-02-09

SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE PROVIDED WITH SOLDER BUMP

#101
20230001520
2023-01-05

SOLDER PASTE

#102
20230001498
2023-01-05

Reflow oven with a zeolite box, and a method for recovering gas with such zeolite box

#103
20220416500
2022-12-29

METHOD FOR MANUFACTURING LASER PACKAGE

#104
20220400590
2022-12-15

Operation of an Assembly Line

#105
20220400557
2022-12-15

Compliant pin surface mount technology pad for rework

#106
20220398714
2022-12-15

Printing solder point quality identification and maintenance suggestion system and method thereof

#107
20220395935
2022-12-15

SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD THEREFOR, SEMICONDUCTOR ELECTRONIC CIRCUIT, AND MOUNTING METHOD THEREFOR

#108
20220394857
2022-12-08

Method for Forming Silicon Carbide Module Integrated Structure

#109
20220384383
2022-12-01

Heat assisted flip chip bonding apparatus

#110
20220379396
2022-12-01

Methods for printing solder paste and other viscous materials at high resolution

#111
20220377909
2022-11-24

Electronic-component carrier board and a wiring method for the same

#112
20220369473
2022-11-17

Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

#113
20220363398
2022-11-17

Surface modified heater assembly

#114
20220362893
2022-11-17

TRANSPORT UNIT FOR TRANSPORTING PRINTED CIRCUIT BOARDS, AND SOLDERING SYSTEM

#115
20220362891
2022-11-17

Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method

#116
20220354034
2022-11-03

ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PRINTED WIRE BOARDS USING LIQUID HEAT MEDIA

#117
20220354000
2022-11-03

CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD MANUFACTURING DEVICE

#118
20220347778
2022-11-03

Laser Printing of Solder Pastes

#119
20220346759
2022-11-03

Method for manufacturing a biological fluid sensor

#120
20220339744
2022-10-27

LOW RESIDUE NO-CLEAN FLUX COMPOSITION AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE USING THE SAME

#121
20220329029
2022-10-13

METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTS

#122
20220328446
2022-10-13

Bonding device and bonding method

#123
20220320811
2022-10-06

LASER SOLDERING METHOD AND DEVICE

#124
20220312585
2022-09-29

Welding quality processing method and device, and circuit board

#125
20220295641
2022-09-15

Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method

#126
20220293436
2022-09-15

Semiconductor substrate bonding tool and methods of operation

#127
20220288726
2022-09-15

BRAZING MATERIAL, BONDED BODY, CERAMIC CIRCUIT BOARD, AND METHOD FOR MANUFACTURING BONDED BODY

#128
20220285874
2022-09-08

CONTACT WITH TWO RESILIENT ARMS MAKING FOUR ABUTTING POINTS WITH A SUBSTRATE HOLE

#129
20220241852
2022-08-04

SINTER-READY SILVER FILMS

#130
20220238478
2022-07-28

ARRANGEMENT FOR FORMING A CONNECTION

#131
20220225498
2022-07-14

Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

#132
20220223748
2022-07-14

SOLAR CELL PANEL MANUFACTURING METHOD AND PASTE FOR SOLAR CELL ELECTRODE USED THEREFOR

#133
20220216384
2022-07-07

ELECTRONIC DEVICE

#134
20220216071
2022-07-07

Semiconductor device and method of manufacture

#135
20220216052
2022-07-07

Integrate rinse module in hybrid bonding platform

#136
20220210924
2022-06-30

SOLDER MASK ARRANGEMENT FOR A COMPONENT CARRIER

#137
20220208719
2022-06-30

Assembly of a chip to a substrate

#138
20220188591
2022-06-16

Contactless card manufacturing apparatus and contactless card manufacturing method

#139
20220181832
2022-06-09

TERMINAL FIXING METHOD

#140
20220166293
2022-05-26

METHOD FOR REPAIRING SOLDER JOINT LEAKAGES AND WELDING OR SOLDERING APPARATUS FOR CARRYING OUT THE METHOD

#141
20220165908
2022-05-26

Method for manufacturing photovoltaic (PV) module

#142
20220157769
2022-05-19

Device and method for reel-to-reel laser reflow

#143
20220148904
2022-05-12

Method for joining quartz pieces and quartz electrodes and other devices of joined quartz

#144
20220143726
2022-05-12

Semiconductor substrate support with multiple electrodes and method for making same

#145
20220132714
2022-04-28

Method for Removing and Repositioning Electronic Components Connected to a Circuit Board

#146
20220132674
2022-04-28

PRINTED WIRING BOARD

#147
20220111305
2022-04-14

GAS PURIFYING APPARATUS, GAS PURIFYING METHOD AND CONVEYING HEATING APPARATUS

#148
20220090232
2022-03-24

Solder alloy, solder paste, solder ball, solder preform, solder joint, and circuit

#149
20220084981
2022-03-17

Diffusion soldering with contaminant protection

#150
20220080704
2022-03-17

Method for producing heat radiation member

#151
20220072641
2022-03-10

Soldering apparatus

#152
20220068665
2022-03-03

Semiconductor device package and method of manufacturing the same

#153
20220063035
2022-03-03

Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods

#154
20220059272
2022-02-24

Magnetic component and method of forming

#155
20220055133
2022-02-24

Brazing methods using porous interlayers and related articles

#156
20220040776
2022-02-10

METHOD FOR CONTROLLING AN EJECTOR, AND RELATED SYSTEM

#157
20220030721
2022-01-27

Mounting method and mounting structure formed by the same

#158
20220009017
2022-01-13

SOLDERING NOZZLE, SYSTEM AND USE

#159
20220001475
2022-01-06

Method for connection by brazing enabling improved fatigue resistance of brazed joints

#160
20210407958
2021-12-30

Radiative heat collective bonder and gangbonder

#161
20210403179
2021-12-30

Space-Based Circuit-Replacing Robotic System

#162
20210398877
2021-12-23

Heat radiation member

#163
20210394320
2021-12-23

Electrostatic chuck with high insulation performance and electrostatic attraction force

#164
20210394292
2021-12-23

Ovens for equipment such as die attach systems, flip chip bonding systems, clip attach systems, and related methods

#165
20210379683
2021-12-09

Assembly and Method for Applying Solder Balls to a Substrate

#166
20210372575
2021-12-02

LED tube lamp

#167
20210362396
2021-11-25

Multi-material fibers and methods of manufacturing the same

#168
20210339330
2021-11-04

GAS CONTROL SYSTEM AND METHOD FOR A REFLOW SOLDERING FURNACE

#169
20210320019
2021-10-14

Apparatus for attaching semiconductor parts

#170
20210316406
2021-10-14

Solder joint

#171
20210315107
2021-10-07

Printed circuit board assembly process using multiple solders and assembled boards made using the same

#172
20210307225
2021-09-30

Profiled thermode

#173
20210305662
2021-09-30

Battery and battery production method

#174
20210301987
2021-09-30

LED lamp and its power source module

#175
20210299800
2021-09-30

Method and device including laser heating of gripper for repairing a test contact arrangement

#176
20210296749
2021-09-23

Electroplating of niobium titanium

#177
20210291286
2021-09-23

Device and method for soldering contact elements with induction heat

#178
20210280547
2021-09-09

Zinc-cobalt barrier for interface in solder bond applications

#179
20210280436
2021-09-09

Method of applying conductive adhesive and manufacturing device using the same

#180
20210276112
2021-09-09

SOLDERING TOOL FOR INDUCTIVE SOLDERING

#181
20210272926
2021-09-02

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

#182
20210268593
2021-09-02

Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint

#183
20210265808
2021-08-26

Semiconductor device and method of manufacturing the semiconductor device

#184
20210257330
2021-08-19

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

#185
20210252621
2021-08-19

Solder removal from semiconductor devices

#186
20210249567
2021-08-12

Lid material for packages including reflowed gold-tin layers, and method for manufacturing package

#187
20210249378
2021-08-12

Ball disposition system, method of disposing a ball on a substrate and method of manufacturing semiconductor device

#188
20210249376
2021-08-12

Low pressure sintering powder

#189
20210249335
2021-08-12

Composite assembly of three stacked joining partners

#190
20210237184
2021-08-05

Systems for printing solder paste and other viscous materials at high resolution

#191
20210229203
2021-07-29

Ultrasonic-assisted solder transfer

#192
20210210667
2021-07-08

USING UNDERFILL OR FLUX TO PROMOTE PLACING AND PARALLEL BONDING OF LIGHT EMITTING DIODES

#193
20210202431
2021-07-01

Laser reflow apparatus and laser reflow method

#194
20210197325
2021-07-01

LOW COST APPROACH FOR DEPOSITING SOLDER AND ADHESIVES IN A PATTERN FOR FORMING ELECTRONIC ASSEMBLIES

#195
20210193611
2021-06-24

Semiconductor device and method for producing semiconductor device

#196
20210176860
2021-06-10

Ceramic circuit board and module using same

#197
20210176859
2021-06-10

Ceramic circuit board and method for producing same

#198
20210167264
2021-06-03

Method for producing an electronic device

#199
20210167034
2021-06-03

CHIP ARRANGEMENTS

#200
20210162551
2021-06-03

COPPER FINE PARTICLE SINTERED BODY

#201
20210154974
2021-05-27

Laminated foil structure and method of forming the same

#202
20210144863
2021-05-13

Method for discharging fluid

#203
20210142703
2021-05-13

Mischarge detection method, mischarge detection apparatus, and display apparatus

#204
20210138590
2021-05-13

Solder joint

#205
20210129260
2021-05-06

Wafer processing method

#206
20210129248
2021-05-06

Solder paste feeding assembly and method

#207
20210129247
2021-05-06

Screen printing machine

#208
20210118843
2021-04-22

Soldering a conductor to an aluminum metallization

#209
20210086277
2021-03-25

High temperature resistant silicon joint for the joining of ceramics

#210
20210082868
2021-03-18

METHOD OF JOINING A SURFACE-MOUNT COMPONENT TO A SUBSTRATE WITH SOLDER THAT HAS BEEN TEMPORARILY SECURED

#211
20210078091
2021-03-18

Reflow oven with a zeolite box, and a method for recovering gas with such zeolite box

#212
20210076735
2021-03-18

CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM

#213
20210076505
2021-03-11

System and method for creating orthogonal solder interconnects

#214
20210069811
2021-03-11

Semiconductor chip bonding apparatus including head having thermally conductive materials

#215
20210068251
2021-03-04

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY

#216
20210060678
2021-03-04

NOZZLE, SYSTEM AND METHOD

#217
20210039182
2021-02-11

Method for Producing a Structural Unit and Method for Connecting a Component to such a Structural Unit

#218
20210037661
2021-02-04

Method for curing solder paste on a thermally fragile substrate

#219
20210023526
2021-01-28

Microwave heating method, microwave heating apparatus, and chemical reaction method

#220
20210001432
2021-01-07

Method of producing a vehicle glass assembly

#221
20200413534
2020-12-31

INSULATED CIRCUIT BOARD

#222
20200400387
2020-12-24

Pattern bonded finned cold plate

#223
20200388590
2020-12-10

Method of vertically vibrating a bonding arm

#224
20200384579
2020-12-10

Soldering material for active soldering and method for active soldering

#225
20200384562
2020-12-10

SYNCHRONOUS MOTION SELECTIVE SOLDERING APPARATUS AND METHOD

#226
20200376609
2020-12-03

Flux, resin flux cored solder, and flux coated pellet

#227
20200367367
2020-11-19

Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow

#228
20200367366
2020-11-19

Sleeve soldering device and method of producing electronic device

#229
20200365474
2020-11-19

Sealing lid formed from translucent material

#230
20200357676
2020-11-12

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

#231
20200353551
2020-11-12

Apparatus for soldering a terminal on window glass for a vehicle and a method thereof

#232
20200350277
2020-11-05

Semiconductor device having reduced bump height variation

#233
20200346293
2020-11-05

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

#234
20200324355
2020-10-15

Reliable transportation mechanism for micro solder balls

#235
20200324354
2020-10-15

Component mounting line control system

#236
20200321310
2020-10-08

Device and method for reel-to-reel laser reflow

#237
20200317587
2020-10-08

Method for fabricating porous ceramic heating body

#238
20200313060
2020-10-01

LED package using electroform stencil printing

#239
20200309808
2020-10-01

Air data probe with fully-encapsulated heater

#240
20200306894
2020-10-01

METALLURGICAL COMPOSITIONS WITH THERMALLY STABLE MICROSTRUCTURES FOR ASSEMBLY IN ELECTRONIC PACKAGING

#241
20200306855
2020-10-01

Solder processing device

#242
20200276663
2020-09-03

WELDING CONNECTION ELEMENT

#243
20200275556
2020-08-27

Flexible circuit board interconnection and methods

#244
20200275555
2020-08-27

Method of manufacturing battery module and interconnect board assembly with integrated PCB and flex circuit

#245
20200269336
2020-08-27

Solder ball feeding device

#246
20200266505
2020-08-20

Method for manufacturing battery stack cooling plate for electric vehicle and cooling plate manufactured thereby

#247
20200262000
2020-08-20

Low temperature direct bonding of aluminum nitride to AlSiC substrates

#248
20200251607
2020-08-06

Method for producing solar cell module

#249
20200245469
2020-07-30

Repairing defective through-holes

#250
20200243480
2020-07-30

Soldering a conductor to an aluminum metallization

#251
20200242440
2020-07-30

Method and an apparatus for producing a radio-frequency identification transponder

#252
20200232609
2020-07-23

LED tube lamp

#253
20200220145
2020-07-09

Multi-layer contact plate and method thereof

#254
20200219841
2020-07-09

Soldering a conductor to an aluminum metallization

#255
20200206835
2020-07-02

Semiconductor substrate support with multiple electrodes and method for making same

#256
20200187364
2020-06-11

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

#257
20200180058
2020-06-11

Heat transfer device for producing a soldered connection of electrical components

#258
20200178944
2020-06-11

Method for manufacturing a biological fluid sensor

#259
20200178387
2020-06-04

Ceramic circuit board and semiconductor module

#260
20200171609
2020-06-04

Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies

#261
20200164453
2020-05-28

Method of forming electrical connections with solder dispensing and reflow

#262
20200164452
2020-05-28

METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDER

#263
20200163226
2020-05-21

Variable temperature controlled soldering iron

#264
20200149690
2020-05-14

LED tube lamp fit for being supplied by a ballast according to the voltage level of an external driving signal

#265
20200149689
2020-05-14

LED tube lamp comprising a thyristor device and a noise suppressing circuit

#266
20200147711
2020-05-14

Automatic solder paste addition apparatus for solder paste printer

#267
20200147708
2020-05-14

Low-profile mechanical retention

#268
20200146144
2020-05-07

Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board

#269
20200144077
2020-05-07

Method of applying conductive adhesive and manufacturing device using the same

#270
20200139466
2020-05-07

Non-destructive identifying of plating dissolution in soldered, plated through-hole

#271
20200138103
2020-05-07

Cartridge for an aerosol-generating system

#272
20200132260
2020-04-30

LED tube lamp for operating in different modes

#273
20200128676
2020-04-23

Facilitating filling a plated through-hole of a circuit board with solder

#274
20200127308
2020-04-23

Dielectric conduit assemblies and methods of making thereof

#275
20200122257
2020-04-23

Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join

#276
20200114447
2020-04-16

Wire fixation apparatus and soldering method

#277
20200111939
2020-04-09

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

#278
20200101549
2020-04-02

Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components

#279
20200094339
2020-03-26

Wire automatic soldering system

#280
20200094335
2020-03-26

Reflow soldering apparatus having independently openable main bodies

#281
20200086412
2020-03-19

Bonding materials of dissimilar coefficients of thermal expansion

#282
20200086411
2020-03-19

Bonding materials of dissimilar coefficients of thermal expansion

#283
20200075416
2020-03-05

Protected chip-scale package (CSP) pad structure

#284
20200052451
2020-02-13

Welding system

#285
20200051947
2020-02-13

Mounting head

#286
20200051939
2020-02-13

Zinc-cobalt barrier for interface in solder bond applications

#287
20200037479
2020-01-30

Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

#288
20200035529
2020-01-30

Semiconductor processing boat design with pressure sensor

#289
20200031725
2020-01-30

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

#290
20200021269
2020-01-16

Electronic devices formed in a cavity between substrates

#291
20200018447
2020-01-16

Led tube lamp with multi-driving mode

#292
20200013741
2020-01-09

Semiconductor device and method for manufacturing the semiconductor device

#293
20200011754
2020-01-09

PRESSURE DETECTION UNIT AND PRESSURE SENSOR USING SAME

#294
20200009671
2020-01-09

Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink

#295
20200006052
2020-01-02

Integrate rinse module in hybrid bonding platform

#296
20190387630
2019-12-19

Electronic component with flexible terminal

#297
20190386456
2019-12-19

Semiconductor device and method of manufacturing the semiconductor device

#298
20190383448
2019-12-19

Mode switching circuit for changing a signal path in an LED tube lamp

#299
20190381591
2019-12-19

MANUFACTURING LINE FOR SOLDERING

#300
20190376651
2019-12-12

LED tube lamp for operating in different modes