Method of producing a vehicle glass assembly

INSULATED CIRCUIT BOARD

Pattern bonded finned cold plate

Method of vertically vibrating a bonding arm

Soldering material for active soldering and method for active soldering

Synchronous motion selective soldering apparatus and method

Flux, resin flux cored solder, and flux coated pellet

Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow

Sleeve soldering device and method of producing electronic device

Sealing lid formed from translucent material

Electrostatic chuck for clamping in high temperature semiconductor processing and method of making same

Apparatus for soldering a terminal on window glass for a vehicle and a method thereof

Semiconductor device having reduced bump height variation

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

Reliable transportation mechanism for micro solder balls

Component mounting line control system

Device and method for reel-to-reel laser reflow

Method for fabricating porous ceramic heating body

LED package using electroform stencil printing

Air data probe with fully-encapsulated heater

METALLURGICAL COMPOSITIONS WITH THERMALLY STABLE MICROSTRUCTURES FOR ASSEMBLY IN ELECTRONIC PACKAGING

Solder processing device

WELDING CONNECTION ELEMENT

Flexible circuit board interconnection and methods

Method of manufacturing battery module and interconnect board assembly with integrated PCB and flex circuit

Solder ball feeding device

Method for manufacturing battery stack cooling plate for electric vehicle and cooling plate manufactured thereby

Low temperature direct bonding of aluminum nitride to AlSiC substrates

Method for producing solar cell module

Repairing defective through-holes

Soldering a conductor to an aluminum metallization

Method and an apparatus for producing a radio-frequency identification transponder

LED tube lamp

Multi-layer contact plate and method thereof

Soldering a conductor to an aluminum metallization

Semiconductor substrate support with multiple electrodes and method for making same

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Heat transfer device for producing a soldered connection of electrical components

Method for manufacturing a biological fluid sensor

Ceramic circuit board and semiconductor module

Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies

Method of forming electrical connections with solder dispensing and reflow

METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDER

Variable temperature controlled soldering iron

LED tube lamp fit for being supplied by a ballast according to the voltage level of an external driving signal

LED tube lamp comprising a thyristor device and a noise suppressing circuit

Automatic solder paste addition apparatus for solder paste printer

Low-profile mechanical retention

Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board

Method of applying conductive adhesive and manufacturing device using the same

Non-destructive identifying of plating dissolution in soldered, plated through-hole

Cartridge for an aerosol-generating system

LED tube lamp for operating in different modes

Facilitating filling a plated through-hole of a circuit board with solder

Dielectric conduit assemblies and methods of making thereof

Method for producing a gas-tight metal-ceramic join and use of the gas-tight metal-ceramic join

Wire fixation apparatus and soldering method

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components

Wire automatic soldering system

Reflow soldering apparatus having independently openable main bodies

Bonding materials of dissimilar coefficients of thermal expansion

Bonding materials of dissimilar coefficients of thermal expansion

Protected chip-scale package (CSP) pad structure

Welding system

Mounting head

Zinc-cobalt barrier for interface in solder bond applications

Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Semiconductor processing boat design with pressure sensor

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

Electronic devices formed in a cavity between substrates

Led tube lamp with multi-driving mode

Semiconductor device and method for manufacturing the semiconductor device

PRESSURE DETECTION UNIT AND PRESSURE SENSOR USING SAME

Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink

Integrate rinse module in hybrid bonding platform

Electronic component with flexible terminal

Semiconductor device and method of manufacturing the semiconductor device

Mode switching circuit for changing a signal path in an LED tube lamp

MANUFACTURING LINE FOR SOLDERING

LED tube lamp for operating in different modes

Soldering method

METHOD FOR MANUFACTURING LIGHT EMITTING MODULE

Variable temperature controlled soldering iron

Component, positioning device and method for fastening the component by soldering

Method of forming a brazed joint having molybdenum material

Substrate with glass sheet, resin layer and through-glass via

LED tube lamp for operating in different modes

Solder printing inspection device, solder printing inspection method and method of manufacturing substrate

Method for producing an electronic device

Microfluidic component package

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

Sn whisker growth mitigation using NiO sublayers

Electronic component structures with reduced microphonic noise

Surface modified heater assembly

Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

Cartridge for an aerosol-generating system

Method for manufacturing hermetic sealing lid member

Soldering method of soldering jig

Method for bonding large modules, and bonding arrangement

Apparatus and method of generating control parameter of screen printer

Method of determining state of iron tip

Component mounting machine

LED tube lamp

Apparatus and method for attaching interconnector of solar cell panel

Component mounting method, component mounting system, and manufacturing method of component mounting board

Circuit board assembly inspection method

Protected chip-scale package (CSP) pad structure

Solder removal from semiconductor devices

Capacitor manufacturing method

Process for manufacturing a leadless feedthrough for an active implantable medical device

Gas purifying apparatus, gas purifying method and conveying heating apparatus

Self-heating solder flux material

Multilayer composite bonding materials and power electronics assemblies incorporating the same

Method for curing solder paste on a thermally fragile substrate

Method for manufacturing electrical connection assembly

Method and system for bonding a chip to a substrate

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

LED tube lamp for operating in different modes

Brazed joint and semiconductor processing chamber component having the same

Display device, display system, and method of installing electronic component

Solder bonding method and solder joint

Solder material

Low-profile mechanical retention

Fabrication of high-temperature superconducting striated tape combinations

Component joining apparatus, component joining method and mounted structure

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms to a Surface

Soldering device

Circuit board and semiconductor module

Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

Systems and methods for attaching printed circuit board to pallet

Advanced solder alloys for electronic interconnects

Burst resistant thin wall heat sink

Ceramic circuit substrate and method for producing ceramic circuit substrate

Ceramic circuit board and semiconductor module

Aluminum based solderable contact

Semiconductor Device and Method of Manufacturing Semiconductor Device

Conductive paste and die bonding method

Use of an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint

Sealed electrical plug connector arrangement

Low-profile mechanical retention

Soldering apparatus

Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus

Apparatus, non-transitory computer readable medium, and method for soldering

Solder alloy and junction structure using same

Recondition process for BGA using flux

Method for self-aligning solder-attached mems die to a mounting surface

Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface

"Lead-Free Solder Ball"

Lead-Free Solder Alloy

Method and device for soldering Hetero-Junction with intrinsic Thin-Film solar cells together to form string

Bonding material, method for producing bonding material, and method for producing bonding structure

Bonding materials of dissimilar coefficients of thermal expansion

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD FOR CUTTING Cu ALLOY

Jet solder bath and jet soldering apparatus

Soldering a conductor to an aluminum metallization

Techniques for joining one or more structures of an electronic device

Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly

Solder paste for reduction gas, and method for producing soldered product

Electrical connector assembly method

Method for bonding flexible part including inclined leads

Fluid discharge device

BGA package substrate and method of manufacturing the same

Soldering method and soldering structure

METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE

Sintering pastes with high metal loading for semiconductor die attach applications

CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

BALL GRID ARRAY SOLDER ATTACHMENT

Method for contacting at least two metal electrodes and arrangement

Thermal Treatment for Preconditioning or Restoration of a Solder Joint

Feedthrough

Reflow soldering oven with at least one gas purification system comprising a catalyst unit

Method for producing soldered product

Brazing methods using porous interlayers and related articles

Ceramic-aluminum conjugate, power module substrate, and power module

LED tube lamp

METHOD FOR FILLING A WAFER VIA WITH SOLDER

Bonding material, and bonding method and bonded structure each using same

Multi-function semiconductor and electronics processing

SOLDER ADHESIVE FOR JOINING OF BATTERY TABS

LIGHT-EMISSION MODULE HAVING COOLER AND PRODUCTION METHOD FOR LIGHT-EMISSION MODULE HAVING COOLER

Injection molded solder bumping

Method for bonding electrical conductors

Electrical connector

Electrodes for electrochemical cells

Producing metal/ceramic circuit board by removing residual silver

Integrated Circuit With Sensor Printed In Situ

Method for placing an SMD semiconductor light source component of an illumination device for a motor vehicle

Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same

Bonded structure and method of manufacturing the same

Melting tool controller

Accurate positioning and alignment of a component during processes such as reflow soldering

Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted article

Soldering jig assembly

Pane with an electrical connection element

High temperature devices and applications employing pure aluminum braze for joining components of said devices

Method and system for automatic bond arm alignment

Component mounting system, component mounter and component mounting method

Process for manufacturing a leadless feedthrough for an active implantable medical device

LED package using electroform stencil printing

Configurable semiconductor package

Ball grid array rework

Leadless multi-layered ceramic capacitor stack

Heater chip, joining apparatus and joining method

Solder paste misprint cleaning

Solder paste misprint cleaning

Carbon-coated metal-powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder

METHOD FOR MANUFACTURING LASER PACKAGE

Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines

Core material, semiconductor package, and forming method of bump electrode

Metal cored solder decal structure and process

Semiconductor processing boat design with pressure sensor

Vacuum pick-up confirmation system

Electronic devices formed in a cavity between substrates and including a via

Methods of manufacturing electronic devices formed in a cavity

Methods of manufacturing electronic devices formed in a cavity and including a via

Leadframe and method of manufacturing the same

Conveyance apparatus

Thin diamond film bonding providing low vapor pressure at high temperature

WIRE BONDING APPARATUS

Noble metal paste for bonding of semiconductor element

Method for cleaning an Electronic circuit board

Manufacturing a product using a soldering process

Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

Method for self-aligning solder-attached MEMS die to a mounting surface

Self-heating solder flux material

Soldering apparatus and method for manufacturing electronic unit

Fluxing systems, bonding machines including fluxing systems, and methods of operating the same

Worktable for soldering iron

Wave soldering nozzle having automatic adjustable throat width

Heating element for SMD mounting

Solder bump stretching method

PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN

Advanced Solder Alloys For Electronic Interconnects

Resistance soldering apparatus and method of using the same

COMPONENT MOUNTING LINE CONTROL SYSTEM

Method for void reduction in solder joints

Conductive polymer composite as plastic solder

Gold wetting on ceramic surfaces upon coating with titanium hydride

Method of joining a surface-mount component to a substrate with solder that has been temporarily secured

Circuit pin positioning structure, fabrication method of soldered circuit elements, and method of forming circuit pins of a stacked package

CHIP BONDING PROCESS

Atomization mechanism for cooling a bond head

Methods of making an electrical connection, and of making a receptacle for receiving an electrical device

Flexible circuit board interconnection and methods

Interconnections Formed with Conductive Traces Applied onto Substrates Having Low Softening Temperatures

Engineered polymer-based electronic materials

Solder processing device

Flux composition containing carbon component, solder paste containing the same, and soldering method

Tool and method of reflow

MAGNETIC SOLDERING APPARATUS

Device, method, and system for cooling a flat object in a nonhomogeneous manner

Brazing method for assembling two elements via an intermetallic compound

Inspection apparatus and quality control system for surface mounting line

Manufacture of electronic circuits

No clean flux composition and methods for use thereof

Connection verification technique

Header assembly for a pressure sensor

Electrical connection tape

Bonding member and bonding method

Magnetoelectric macro fiber composite fabricated using low temperature transient liquid phase bonding

LED tube lamp

Solder Preforms and Solder Alloy Assembly Methods

Conductive connections, structures with such connections, and methods of manufacture

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for producing light-emitting device

Enhanced cleaning for water-soluble flux soldering

Lead-Free Solder Ball

Flux applying method and flux applying apparatus

Cable connector assembly and improved cable

Carbon-coated metal powder, conductive paste containing carbon-coated metal powder and multilayer electronic component using same, and method for manufacturing carbon-coated metal powder

LED tube lamp with operating modes compatible with electrical ballasts

Interconnect alloy material and methods

Method and device for laser soldering an electric circuit of a heating portion of an electronic cigarette

Hermetic sealing lid member

Removal apparatuses for semiconductor chips

Assembly methods of a SMA assembly and an OIS device

Printing device, solder management system, and printing managing method

Solder paste misprint cleaning

Active brazing material and method for active brazing of components

Conductive particle, and connection material, connection structure, and connecting method of circuit member

Connection structure and connecting method of circuit member

Cartridge for an aerosol-generating system

Method of manufacturing terminal-formed electric wire

Heat transfer device for producing a soldered connection of electrical components

Connecting method of circuit member

Printed circuit board, method for manufacturing printed circuit board, and method for joining conductive member

Chip arrangements

METHOD FOR MANUFACTURING CERAMIC HEATER-TYPE GLOW PLUG, AND CERAMIC HEATER-TYPE GLOW PLUG

METHOD FOR MANUFACTURING CERAMIC HEATER-TYPE GLOW PLUG, AND CERAMIC HEATER-TYPE GLOW PLUG

Microfeature workpieces having alloyed conductive structures, and associated methods

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF, AND WIRED CIRCUIT BOARD ASSEMBLY AND PRODUCING METHOD THEREOF

Chip joining by induction heating

Method of forming an enclosure

Semiconductor chip assembly and method for making same

Automatic assembling system for improving yield of automatic assembly of printed circuit board, and automatic assembling method

Three-dimensional chip stack and method of forming the same

Low resistance interface metal for disk drive suspension component grounding

METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING

Microscale three-dimensional electric devices and methods of making the same

Metal wiring bonding structure and production method therefor